Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
0009483034 Woodhead - Molex	CONN RCPT 3POS 0.156 GOLD PCB	0
5031482690 Woodhead - Molex	CONN RCPT 26P 0.059 TIN SMD R/A	2386
0448120016 Woodhead - Molex	CONN RCPT 16POS 0.1 TIN PCB	720
0022142184 Woodhead - Molex	CONN RCPT 18POS 0.1 TIN PCB	56
0447692003 Woodhead - Molex	CONN RCPT 20POS 0.118 GOLD PCB	0
0901481205 Woodhead - Molex	CONN RCPT 5POS 0.1 GOLD PCB R/A	1517
5031481490 Woodhead - Molex	CONN RCPT 14P 0.059 TIN SMD R/A	1530
0432550019 Woodhead - Molex	CONN HDR 4POS 0.25 TIN PCB	183
0009484078 Woodhead - Molex	CONN RCPT 7POS 0.156 TIN PCB	45
0022142034 Woodhead - Molex	CONN RCPT 3POS 0.1 TIN PCB	225
0448120030 Woodhead - Molex	CONN RCPT 12POS 0.1 GOLD PCB	0
5024941470 Woodhead - Molex	CONN RCPT 14P 0.079 TIN SMD R/A	0
5033950610 Woodhead - Molex	CONN RCPT 6POS 0.059 TIN SMD	60949600
5019312070 Woodhead - Molex	CONN RCPT 20POS 0.049 GOLD SMD	2894
0447692203 Woodhead - Molex	CONN RCPT 22POS 0.118 GOLD PCB	0
0009483105 Woodhead - Molex	CONN RCPT 10P 0.156 GOLD EDGE MT	538
0901512110 Woodhead - Molex	CONN RCPT 10POS 0.1 TIN PCB	1851
5031543490 Woodhead - Molex	CONN RCPT 34POS 0.059 TIN SMD	5259
0015247160 Woodhead - Molex	CONN RCPT 16POS 0.165 TIN PCB	1915
0791091006 Woodhead - Molex	CONN RCPT 14POS 0.079 GOLD SMD	1316

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers