Rectangular Connectors - Headers, Male Pins

Part Number	Description / PDF	Quantity
0877590674 Woodhead - Molex	CONN HEADER SMD 6POS 2MM	55
0901220143 Woodhead - Molex	CONN HEADER R/A 46POS 2.54MM	0
0022112142 Woodhead - Molex	CONN HEADER VERT 14POS 2.54MM	1712
0022289033 Woodhead - Molex	CONN HEADER R/A 3POS 2.54MM	29308
0015910420 Woodhead - Molex	CONN HEADER SMD 42POS 2.54MM	0
0010845090 Woodhead - Molex	CONN HEADER VERT 9POS 6.35MM	752
0022102132 Woodhead - Molex	CONN HEADER VERT 13POS 2.54MM	0
2170640041 Woodhead - Molex	2.0 RA ASSY 4CKT ETP BK _GW	0
0039301141 Woodhead - Molex	CONN HEADER R/A 14POS 4.2MM	198
0022286041 Woodhead - Molex	CONN HEADER R/A 4POS 2.54MM	0
1053142116 Woodhead - Molex	CONN HEADER R/A 16POS 2.5MM	715
0010897141 Woodhead - Molex	CONN HEADER VERT 14POS 2.54MM	5428
0022285077 Woodhead - Molex	CONN HEADER VERT 7POS 2.54MM	0
0430450658 Woodhead - Molex	CONN HEADER R/A 6POS 3MM	0
0702800689 Woodhead - Molex	CONN HEADER VERT 42POS 2.54MM	0
0026503099 Woodhead - Molex	CONN HEADER VERT 9POS 3.96MM	0
0347930040 Woodhead - Molex	CONN HEADER R/A 4POS 2MM	20
0878321006 Woodhead - Molex	CONN HEADER SMD 10POS 2MM	3494
0908140512 Woodhead - Molex	CONN HEADER SMD 12POS 1.27MM	2079
0026602030 Woodhead - Molex	CONN HEADER VERT 3POS 3.96MM	3340

Rectangular Connectors - Headers, Male Pins

1. Overview

Rectangular connectors with male pins, commonly referred to as pin headers, are modular electrical interfaces featuring parallel rows of conductive prongs enclosed in a dielectric housing. These components enable reliable signal and power transmission between PCBs (Printed Circuit Boards), cables, and subsystems. Their standardized design, ease of assembly, and scalability make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Single-Row Headers	Linear arrangement, 0.1" pitch standard, low-cost solution	Prototyping boards, Arduino shields
Double-Row Headers	Parallel dual-row configuration, higher contact density	Industrial control systems, PLC modules
High-Density Headers	Sub-0.05" pitch, optimized for miniaturization	Smartphones, medical sensors
Right-Angle Headers	90 oriented pins for vertical space optimization	Automotive ECUs, server motherboards

3. Structure and Composition

Typical male pin headers consist of:

Contact System: Phosphor bronze or beryllium copper pins with gold-plated contact areas
Insulation Housing: High-temperature resistant LCP (Liquid Crystal Polymer) or nylon material
Mechanical Features: Polarization keying, anti-wobble design, and retention latches
Mounting Options: Through-hole, SMT (Surface Mount Technology), or press-fit terminations

The contacts are arranged in standardized grids (commonly 2.54mm/0.1" pitch) with polarization features to prevent mis-mating.

4. Key Technical Specifications

Parameter	Importance
Current Rating (Amps/contact)	0.5-10A determines power handling capability
Contact Resistance (m )	10-30m affects signal integrity and power efficiency
Dielectric Withstanding Voltage	100-1000V defines insulation reliability
Operating Temperature Range	-55 C to +125 C ensures environmental durability
Insertion Force (N)	0.5-5N impacts mating cycle longevity

5. Application Fields

Consumer Electronics: Laptops, gaming consoles, smart home devices
Automotive: ECU interconnects, sensor harnesses, infotainment systems
Industrial: CNC machine controllers, robotics interfaces
Medical: Diagnostic equipment, patient monitoring systems
Telecom: Base station hardware, fiber optic transceivers

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	AMPMODU 205796-1 (0.05" micro pitch header)
Molex	PicoBlade 0510210400 (ultra-compact wire-to-board connector)
Amphenol ICC	10118801-01 (high-speed differential pair header)
JAE Electronics	DF11 Series (0.5mm pitch FPC-to-PCB connector)

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage rating)
Space constraints (pitch size and profile height)
Environmental conditions (temperature, vibration, moisture)
Termination method compatibility (through-hole vs SMT)
Expected mating cycles (durability requirements)
Cost vs performance trade-offs

Example: For automotive applications, select headers with AEC-Q200 certification and 3 m gold plating for vibration resistance.

8. Industry Trends

Miniaturization: Development of 0.3mm pitch connectors for wearable devices
High-Speed Performance: Optimization for 10+ Gbps data rates in 5G infrastructure
Modular Design: Integration with hybrid power/signal transmission capabilities
Sustainability: Adoption of halogen-free materials and RoHS compliance
Smart Manufacturing: Embedded RFID tags for connector lifecycle tracking