Rectangular Connectors - Headers, Male Pins

Part Number	Description / PDF	Quantity
0460150407 Woodhead - Molex	CONN HEADER VERT 4POS 4.2MM	4750
0015910060 Woodhead - Molex	CONN HEADER SMD 6POS 2.54MM	22527
0015477720 Woodhead - Molex	CONN HEADER VERT 20POS 2.54MM	0
1722861305 Woodhead - Molex	CONN HEADER VERT 5POS 3.5MM	1294
0702871129 Woodhead - Molex	CONN HEADER VERT 66POS 2.54MM	0
0022284060 Woodhead - Molex	CONN HEADER VERT 6POS 2.54MM	2103
0702871148 Woodhead - Molex	CONN HEADER VERT 6POS 2.54MM	0
0022284344 Woodhead - Molex	CONN HEADER VERT 34POS 2.54MM	0
2170630037 Woodhead - Molex	2.0 ST ASSY 3CKT ETP BK CV_GW PO	0
0022035075 Woodhead - Molex	CONN HEADER VERT 7POS 2.5MM	9890
0022285061 Woodhead - Molex	CONN HEADER VERT 6POS 2.54MM	10380
0022232033 Woodhead - Molex	CONN HEADER VERT 3POS 2.54MM	1326
0436501109 Woodhead - Molex	CONN HEADER SMD R/A 11POS 3MM	0
1510482203 Woodhead - Molex	CONN HEADER VERT 2POS	5268
0901220129 Woodhead - Molex	CONN HEADER R/A 18POS 2.54MM	0
0878325523 Woodhead - Molex	CONN HEADER SMD 12POS 2MM	0
0713084188 Woodhead - Molex	CONN HEADER SMD 88POS 2.54MM	0
5013310907 Woodhead - Molex	CONN HEADER SMD 9POS 1MM	5075
0022283346 Woodhead - Molex	CONN HEADER VERT 34POS 2.54MM	0
0713085096 Woodhead - Molex	CONN HEADER SMD 96POS 2.54MM	0

Rectangular Connectors - Headers, Male Pins

1. Overview

Rectangular connectors with male pins, commonly referred to as pin headers, are modular electrical interfaces featuring parallel rows of conductive prongs enclosed in a dielectric housing. These components enable reliable signal and power transmission between PCBs (Printed Circuit Boards), cables, and subsystems. Their standardized design, ease of assembly, and scalability make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Single-Row Headers	Linear arrangement, 0.1" pitch standard, low-cost solution	Prototyping boards, Arduino shields
Double-Row Headers	Parallel dual-row configuration, higher contact density	Industrial control systems, PLC modules
High-Density Headers	Sub-0.05" pitch, optimized for miniaturization	Smartphones, medical sensors
Right-Angle Headers	90 oriented pins for vertical space optimization	Automotive ECUs, server motherboards

3. Structure and Composition

Typical male pin headers consist of:

Contact System: Phosphor bronze or beryllium copper pins with gold-plated contact areas
Insulation Housing: High-temperature resistant LCP (Liquid Crystal Polymer) or nylon material
Mechanical Features: Polarization keying, anti-wobble design, and retention latches
Mounting Options: Through-hole, SMT (Surface Mount Technology), or press-fit terminations

The contacts are arranged in standardized grids (commonly 2.54mm/0.1" pitch) with polarization features to prevent mis-mating.

4. Key Technical Specifications

Parameter	Importance
Current Rating (Amps/contact)	0.5-10A determines power handling capability
Contact Resistance (m )	10-30m affects signal integrity and power efficiency
Dielectric Withstanding Voltage	100-1000V defines insulation reliability
Operating Temperature Range	-55 C to +125 C ensures environmental durability
Insertion Force (N)	0.5-5N impacts mating cycle longevity

5. Application Fields

Consumer Electronics: Laptops, gaming consoles, smart home devices
Automotive: ECU interconnects, sensor harnesses, infotainment systems
Industrial: CNC machine controllers, robotics interfaces
Medical: Diagnostic equipment, patient monitoring systems
Telecom: Base station hardware, fiber optic transceivers

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	AMPMODU 205796-1 (0.05" micro pitch header)
Molex	PicoBlade 0510210400 (ultra-compact wire-to-board connector)
Amphenol ICC	10118801-01 (high-speed differential pair header)
JAE Electronics	DF11 Series (0.5mm pitch FPC-to-PCB connector)

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage rating)
Space constraints (pitch size and profile height)
Environmental conditions (temperature, vibration, moisture)
Termination method compatibility (through-hole vs SMT)
Expected mating cycles (durability requirements)
Cost vs performance trade-offs

Example: For automotive applications, select headers with AEC-Q200 certification and 3 m gold plating for vibration resistance.

8. Industry Trends

Miniaturization: Development of 0.3mm pitch connectors for wearable devices
High-Speed Performance: Optimization for 10+ Gbps data rates in 5G infrastructure
Modular Design: Integration with hybrid power/signal transmission capabilities
Sustainability: Adoption of halogen-free materials and RoHS compliance
Smart Manufacturing: Embedded RFID tags for connector lifecycle tracking