Rectangular Connectors - Board Spacers, Stackers (Board to Board)

Part Number	Description / PDF	Quantity
DW-18-12-L-S-472 Samtec, Inc.	CONN HDR 18POS 0.1 STACK T/H	153
TW-02-05-L-D-315-100 Samtec, Inc.	CONN BRD STACK 2.00 4POS	372
HDWM-15-57-G-S-450-SM Samtec, Inc.	CONN HDR 15POS 0.05 STACK SMD	0
HW-10-11-L-S-550-130 Samtec, Inc.	CONN HDR 10POS 0.1 STACK T/H	346
FW-15-03-G-D-250-140-A-P Samtec, Inc.	CONN HDR 30POS 0.05 STACK SMD	0
DW-04-12-G-S-724 Samtec, Inc.	CONN HDR 4POS 0.1 STACK T/H GOLD	986
DW-07-15-L-D-275 Samtec, Inc.	CONN HDR 14POS 0.1 STACK T/H	445
ZW-05-11-G-D-550-185 Samtec, Inc.	CONN BRD STACK .100" 10POS	1344
TW-08-03-T-D-260-100 Samtec, Inc.	CONN BRD STACK 2.00 16POS	208
FW-25-01-G-D-200-315 Samtec, Inc.	CONN HDR 50POS 0.05 STACK T/H	0
FW-22-05-L-D-539-082-A Samtec, Inc.	CONN HDR 44POS 0.05 STACK SMD	0
DW-04-09-S-D-430 Samtec, Inc.	CONN HDR 8POS 0.1 STACK T/H GOLD	2105
DW-18-11-S-D-500 Samtec, Inc.	CONN HDR 36POS 0.1 STACK T/H	439
HW-08-09-L-D-330-SM Samtec, Inc.	CONN HDR 16POS 0.1 STACK SMD	210
TW-20-02-G-D-158-138 Samtec, Inc.	CONN BRD STACK 2.00 40POS	134
DW-05-14-T-S-1201 Samtec, Inc.	CONN HDR 5POS 0.1 STACK T/H TIN	269
HW-25-20-T-D-800-SM Samtec, Inc.	CONN HDR 50POS 0.1 STACK SMD TIN	76
DW-23-08-F-D-200 Samtec, Inc.	CONN HDR 46POS 0.1 STACK T/H	0
FW-25-05-F-D-570-090 Samtec, Inc.	CONN HDR 50POS 0.05 STACK SMD	0
DW-12-15-G-D-290 Samtec, Inc.	CONN HDR 24POS 0.1 STACK T/H	292

Rectangular Connectors - Board Spacers, Stackers (Board to Board)

1. Overview

Rectangular board spacers and stackers are interconnect solutions designed to establish mechanical and electrical connections between two or more printed circuit boards (PCBs). These connectors maintain precise spacing while enabling signal/power transmission. Their importance in modern electronics includes enabling compact designs, modular system architectures, and reliable high-speed data transfer in applications ranging from consumer devices to industrial equipment.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Board Spacers	Fixed pitch, non-mating interconnects with insulating pillars	Smartphone mid-frames, IoT sensor modules
Stacking Connectors	Self-mating design with compressible contacts	Embedded computing boards, FPGA development kits
High-Speed Stackers	Controlled impedance, low crosstalk design	5G base stations, network switches
Compliant Pin Stackers	Press-fit terminations for Z-axis compliance	Automotive radar systems, medical imaging devices

3. Structure and Components

Typical construction includes:

Insulating housing (LCP/PBT with UL94 V-0 rating)
Phosphor bronze or beryllium copper contacts
Gold-plated contact areas (0.5-3 m thickness)
Polarization keying to prevent misalignment
Integrated locking mechanisms (latches/snap-fits)
Optional EMI shielding layers

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	0.5A - 5A per contact	Dictates power delivery capability
Contact Resistance	5-20m	Impacts signal integrity
Dielectric Strength	500V - 2500V AC	Ensures electrical safety
Operating Temperature	-55 C to +125 C	Determines environmental robustness
Insertion Force	0.5N - 5N per contact	Affects assembly process
Mating Cycles	500 - 10,000 cycles	Defines service life expectancy

5. Application Fields

Telecommunications: Server backplanes, 5G NR radios
Industrial Automation: PLC modules, CNC controller stacks
Consumer Electronics: Foldable device hinge connectors
Medical Devices: MRI system detector arrays
Automotive: ADAS sensor stacking modules

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TE Connectivity	SMART Board Stacker	12 Gbps capability, self-aligning
Molex	Impel High-Speed Connector	25+ Gbps, floating compliance
Amphenol	CBGA Interposer	Micro BGA footprint compatibility
JAE Electronics	DF59 Series	0.4mm pitch, 0.3mm stack height

7. Selection Recommendations

Key considerations:

Electrical requirements vs. contact density needs
Stack height tolerance stack-up analysis
Thermal expansion coefficient matching
Field serviceability requirements
Automated optical inspection (AOI) compatibility

Case Study: In automotive camera module design, compliant pin stackers reduced assembly time by 40% while maintaining ISO 16750 vibration compliance.

8. Industry Trends

Migration to 0.3mm pitch connectors for mobile applications
Integration of coaxial contacts for RF board-to-board links
Adoption of additive manufacturing for complex shapes
Increased adoption of press-fit terminations in harsh environments
Development of hybrid optical-electrical stacking solutions