Memory Connectors - PC Card Sockets

Image	Part Number	Description / PDF	Quantity	Rfq
	IC1F-68PD-1.27DS-EJ Hirose	CONN PCMCIA CARD PUSH-PUSH R/A	0
	IC11-BD-EJR Hirose	CONN PCMCIA CARD PUSH-PUSH	0
	IC11S-BD-PNEJL(71) Hirose	CONN PCMCIA CARD PUSH-PUSH	0
	AXA2R63061P Panasonic	CONN SD CARD PUSH-PUSH R/A SMD	0
	DM3AT-SF-PEJM5(26) Hirose	CONN MICRO SD R/A PUSH-PUSH SMD	0
	0473880001 Woodhead - Molex	CONN SIM CARD HINGED TYPE R/A	0
	145738009220859+ KYOCERA Corporation	CONN SD CARD PUSH-PUSH R/A SMD	0
	132001-0400 VEAM	CONN COMPACT FLASH CARD R/A SMD	0
	ID2M-8S-2.54DS(72) Hirose	CONN SMART CARD PUSH-PULL R/A	0
	92194-320CALF Storage & Server IO (Amphenol ICC)	CONN PCMCIA CARD PUSH-PUSH R/A	0
	CCM03-3012 C&K	CONN SIM/SAM CARD HINGED TYPE	0
	SF50S006V4CR1500 JAE Electronics	CONN MICRO SIM CARD PUSH-PULL	0
	61126-050CALF Storage & Server IO (Amphenol ICC)	CONN PCMCIA CARD PUSH-PUSH R/A	0
	C702 10M008 9062 Tuchel / Amphenol	CONN SMART CARD PUSHMATIC	0
	1903572-1 TE Connectivity AMP Connectors	CONN SD CARD PUSH-PUSH R/A PCB	0
	CB1EB-10S-1.5H-PEJC2(52) Hirose	CONN MEM STICK 10POS 1.5MM SMD	0
	0912283001 Woodhead - Molex	CONN SIM CARD PUSH-PUSH R/A SMD	0
	558666-4 TE Connectivity AMP Connectors	CONN PCMCIA CARD PUSH-PULL	0
	5-558556-4 TE Connectivity AMP Connectors	CONN PCMCIA CARD PUSH-PULL	0
	10053826-100ABTLF Storage & Server IO (Amphenol ICC)	CONN PCMCIA CARD PUSH-PULL R/A	0

Memory Connectors - PC Card Sockets

1. Overview

PC Card Sockets (Personal Computer Memory Card International Association Sockets) are standardized expansion interfaces for connecting peripheral devices to computing systems. Defined by the PCMCIA standard, these connectors enable hot-swappable integration of memory modules, storage devices, network adapters, and other functional components. Their compact form factor and universal compatibility have made them critical in portable electronics, industrial equipment, and embedded systems.

2. Main Types and Functional Classification

Type	Physical Dimensions (mm)	Functional Features	Application Examples
Type I	54 85.6 3.3	16-bit ISA bus, 68-pin	Memory expansion cards
Type II	54 85.6 5.0	16/32-bit bus support	Modem, LAN adapters
Type III	54 85.6 10.5	32-bit CardBus interface	Hard disk drives
ExpressCard	54 75 5.0 or 34 75 5.0	PCIe/GPIO interface, 26-pin	High-speed SSD interfaces

3. Structure and Components

Typical PC card sockets consist of:

Dielectric Housing: High-temperature resistant LCP material
Contact Array: Gold-plated phosphor bronze contacts (10-30 m plating)
Actuation Mechanism: Ejector levers with tactile feedback
Locking System: Mechanical retention springs
EMI Shielding: Integrated metal cans (0.1-0.3mm thickness)

The contact pitch typically measures 1.27mm with 0.8mm contact spacing, supporting blind-mating designs.

4. Key Technical Specifications

Parameter	Typical Value	Importance
Contact Resistance	10-30m	Signal integrity maintenance
Current Rating	1.0A per contact	Power delivery capability
Dielectric Withstand	1000VAC	Electrical safety compliance
Operating Temperature	-55 C to +85 C	Environmental reliability
Mating Cycles	10,000+	Durability indicator

5. Application Fields

Primary industries include:

Consumer Electronics: Notebook computers, digital cameras
Industrial Automation: Programmable logic controllers (PLCs)
Medical Devices: Portable diagnostic equipment
Telecommunications: Wireless base stations
Military/Aerospace: Ruggedized computing systems

Case Example: Siemens industrial PCs use Type III sockets for CFast storage modules in factory automation systems.

6. Leading Manufacturers and Products

Manufacturer	Key Product Series	Technical Features
Amphenol ICC	515 Series	Low-profile Type II sockets
Molex	47220 Series	CardBus compatible
TE Connectivity	1-1461885	ExpressCard 34mm design
Samtec	ASP-200404	High-speed differential pairs

7. Selection Guidelines

Key considerations:

Interface Compatibility: Match bus type (16-bit/32-bit/CardBus/PCIe)
Current Capacity: Verify power requirements (e.g., 3.3V/5V support)
Vibration Resistance: Select locking mechanisms for mobile applications
Thermal Management: Evaluate current carrying capacity under load
RoHS Compliance: Confirm lead-free termination options

Best Practice: For industrial applications, specify extended temperature (-40 C to +85 C) socket designs.

8. Industry Trends

Current development directions:

Miniaturization: Transition from PCMCIA to ExpressCard/USB4 form factors
Speed Enhancement: Support for PCIe Gen4 (16GT/s) protocols
Multi-functionality: Integrated power/signal contacts
Material Innovation: Graphene-enhanced contact plating
Standard Evolution: Migration towards USB4/Thunderbolt compatibility

Market forecasts predict sustained demand in industrial sectors despite consumer market decline.