Memory Connectors - PC Card Sockets

Image Part Number Description / PDF Quantity Rfq
101-00434-68

101-00434-68

Storage & Server IO (Amphenol ICC)

CONN MICRO SD/SIM CARD PUSH-PULL

0

CCM02-2503LFT T30

CCM02-2503LFT T30

C&K

CONN SMART CARD PUSH-PULL R/A

0

ST4S008V4AR1500

ST4S008V4AR1500

JAE Electronics

CONN MICRO SD CARD PUSH-PUSH R/A

0

CCM04-1889LFT R102

CCM04-1889LFT R102

C&K

CONN SMART CARD PUSH-PULL R/A

0

2286237-1

2286237-1

TE Connectivity AMP Connectors

BLOCK SIM CARD CONNECTOR

0

1510590001

1510590001

Woodhead - Molex

CONN SIM CRD W/NANO SIM CRD SKT

0

MI21-50PD-SF

MI21-50PD-SF

Hirose

CONN COMPACT FLASH CARD R/A SMD

0

IC1FA-68PD-1.27DS

IC1FA-68PD-1.27DS

Hirose

CONN PCMCIA CARD PUSH-PULL R/A

0

IC1BB-68RD-1.27SH

IC1BB-68RD-1.27SH

Hirose

CONN PCMCIA CARD PUSH-PULL

0

305620000006000+

305620000006000+

KYOCERA Corporation

CONN COMPACT FLASH CARD SNAP-IN

0

SG5S009V1A1R400

SG5S009V1A1R400

JAE Electronics

CONN SD CARD PUSH-PUSH R/A SMD

0

10010556-004LF

10010556-004LF

Storage & Server IO (Amphenol ICC)

CONN SMART CARD PUSH-PULL

0

CCM02-2503

CCM02-2503

C&K

CONN SMART CARD PUSH-PULL R/A

0

DM2A-SFW-PEJ-S(03)

DM2A-SFW-PEJ-S(03)

Hirose

CONN MEMORY MINI SD TOP MT SMD

0

2108431-3

2108431-3

TE Connectivity AMP Connectors

ASS'Y FOR MICRO SIM H1.24 8POS (

0

SF7W006S1BE1100

SF7W006S1BE1100

JAE Electronics

CONN SIM CARD HINGED TYPE R/A

0

045036006100862

045036006100862

Elco (AVX)

CONN SIM CARD PUSH-PUSH R/A SMD

0

PX20-BB2-C100

PX20-BB2-C100

JAE Electronics

CONN PCMCIA CARD PUSH-PULL R/A

0

1981898-1

1981898-1

TE Connectivity AMP Connectors

CONN MINI SIM CARD PUSH-PULL R/A

0

0538565078

0538565078

Woodhead - Molex

CONN COMPACT FLASH CARD R/A SMD

0

Memory Connectors - PC Card Sockets

1. Overview

PC Card Sockets (Personal Computer Memory Card International Association Sockets) are standardized expansion interfaces for connecting peripheral devices to computing systems. Defined by the PCMCIA standard, these connectors enable hot-swappable integration of memory modules, storage devices, network adapters, and other functional components. Their compact form factor and universal compatibility have made them critical in portable electronics, industrial equipment, and embedded systems.

2. Main Types and Functional Classification

TypePhysical Dimensions (mm)Functional FeaturesApplication Examples
Type I54 85.6 3.316-bit ISA bus, 68-pinMemory expansion cards
Type II54 85.6 5.016/32-bit bus supportModem, LAN adapters
Type III54 85.6 10.532-bit CardBus interfaceHard disk drives
ExpressCard54 75 5.0 or 34 75 5.0PCIe/GPIO interface, 26-pinHigh-speed SSD interfaces

3. Structure and Components

Typical PC card sockets consist of:

  • Dielectric Housing: High-temperature resistant LCP material
  • Contact Array: Gold-plated phosphor bronze contacts (10-30 m plating)
  • Actuation Mechanism: Ejector levers with tactile feedback
  • Locking System: Mechanical retention springs
  • EMI Shielding: Integrated metal cans (0.1-0.3mm thickness)
The contact pitch typically measures 1.27mm with 0.8mm contact spacing, supporting blind-mating designs.

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance10-30m Signal integrity maintenance
Current Rating1.0A per contactPower delivery capability
Dielectric Withstand1000VACElectrical safety compliance
Operating Temperature-55 C to +85 CEnvironmental reliability
Mating Cycles10,000+Durability indicator

5. Application Fields

Primary industries include:

  • Consumer Electronics: Notebook computers, digital cameras
  • Industrial Automation: Programmable logic controllers (PLCs)
  • Medical Devices: Portable diagnostic equipment
  • Telecommunications: Wireless base stations
  • Military/Aerospace: Ruggedized computing systems
Case Example: Siemens industrial PCs use Type III sockets for CFast storage modules in factory automation systems.

6. Leading Manufacturers and Products

ManufacturerKey Product SeriesTechnical Features
Amphenol ICC515 SeriesLow-profile Type II sockets
Molex47220 SeriesCardBus compatible
TE Connectivity1-1461885ExpressCard 34mm design
SamtecASP-200404High-speed differential pairs

7. Selection Guidelines

Key considerations:

  • Interface Compatibility: Match bus type (16-bit/32-bit/CardBus/PCIe)
  • Current Capacity: Verify power requirements (e.g., 3.3V/5V support)
  • Vibration Resistance: Select locking mechanisms for mobile applications
  • Thermal Management: Evaluate current carrying capacity under load
  • RoHS Compliance: Confirm lead-free termination options
Best Practice: For industrial applications, specify extended temperature (-40 C to +85 C) socket designs.

8. Industry Trends

Current development directions:

  • Miniaturization: Transition from PCMCIA to ExpressCard/USB4 form factors
  • Speed Enhancement: Support for PCIe Gen4 (16GT/s) protocols
  • Multi-functionality: Integrated power/signal contacts
  • Material Innovation: Graphene-enhanced contact plating
  • Standard Evolution: Migration towards USB4/Thunderbolt compatibility
Market forecasts predict sustained demand in industrial sectors despite consumer market decline.

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