Memory Connectors - Inline Module Sockets

Image Part Number Description / PDF Quantity Rfq
0780658102

0780658102

Woodhead - Molex

CONN SKT DIMM 240POS PCB

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0876391010

0876391010

Woodhead - Molex

CONN SKT DIMM 184POS PCB REV

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0541891440

0541891440

Woodhead - Molex

CONN SKT SODIMM 144POS R/A SMD

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0876232101

0876232101

Woodhead - Molex

CONN SKT DIMM 184POS PCB

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0781250001

0781250001

Woodhead - Molex

CONN SKT DIMM 240POS SMD

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0780610012

0780610012

Woodhead - Molex

CONN SKT FB-DIMM 240POS PCB

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0876930301

0876930301

Woodhead - Molex

CONN SKT DIMM 184POS PCB

0

0780790062

0780790062

Woodhead - Molex

CONN SKT DIMM 240POS PCB

0

0784430001

0784430001

Woodhead - Molex

CONN SKT DIMM 240POS PCB

0

0876550007

0876550007

Woodhead - Molex

CONN SKT DIMM 184POS R/A PCB

0

0785880052

0785880052

Woodhead - Molex

CONN SKT DDR3 1MM TH

0

0785070061

0785070061

Woodhead - Molex

CONN SKT DDR3 DIMM 1MM

0

0876090162

0876090162

Woodhead - Molex

CONN SKT DIMM 168POS R/A PCB

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0785070112

0785070112

Woodhead - Molex

CONN SKT DDR3 DIMM 1MM

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0877468011

0877468011

Woodhead - Molex

CONN SKT DIMM 240POS PCB

0

0879660002

0879660002

Woodhead - Molex

CONN SKT DIMM 240POS SMD

0

0876232013

0876232013

Woodhead - Molex

CONN SKT DIMM 184POS PCB

0

0780790002

0780790002

Woodhead - Molex

CONN SKT DIMM 240POS PCB

0

0876391130

0876391130

Woodhead - Molex

CONN SKT DIMM 184POS REV

0

0876935311

0876935311

Woodhead - Molex

CONN SKT DIMM 184POS PCB

0

Memory Connectors - Inline Module Sockets

1. Overview

Inline Module Sockets are electro-mechanical interfaces designed to connect memory modules (e.g., DRAM, SRAM) to printed circuit boards (PCBs). These connectors ensure reliable electrical conductivity, mechanical stability, and signal integrity in high-speed data transmission environments. They play a critical role in computing systems, telecommunications infrastructure, and industrial equipment by enabling modular memory upgrades and maintenance.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
DIMM Socket64-bit data path, 240/288 pins, ZIF technologyDesktop/server RAM modules
SO-DIMM SocketSmaller form factor, 200/260 pins, low insertion forceLaptops, embedded systems
UDIMM SocketUnbuffered design, direct memory controller connectionConsumer PCs, workstations
RDIMM SocketRegistered buffering for improved signal stabilityEnterprise servers, data centers

3. Structure and Composition

Typical components include:

  • Contact points: Phosphor bronze or beryllium copper with gold plating
  • Insulation housing: High-temperature resistant thermoplastics (LCP, PBT)
  • Actuator mechanism: Z-axis compression system for secure module retention
  • PCB termination: Through-hole or surface-mount solder tails

Advanced designs incorporate impedance-matched contacts and anti-vibration locking features.

4. Key Technical Parameters

ParameterTypical ValueImportance
Contact Resistance 10m Ensures minimal signal loss
Current Rating1-3A per pinDetermines power delivery capability
Operating Temperature-55 C to +125 CGuarantees performance in extreme conditions
Insertion Life1000+ cyclesAffects product longevity

5. Application Fields

  • Computer hardware: Motherboards, GPU memory interfaces
  • Telecommunications: 5G base stations, network switches
  • Industrial automation: PLC controllers, vision systems
  • Medical equipment: Imaging devices, patient monitors

6. Leading Manufacturers and Products

ManufacturerProduct SeriesSpecial Features
TE ConnectivityMAX Density DIMM36% higher pin density
Amphenol ICCVerge X112Gbps data rate support
MolexDDR5 UDIMMIntegrated error detection

7. Selection Recommendations

Key considerations:

  • Memory standard compatibility (DDR4/DDR5, RDIMM/UDIMM)
  • Vibration resistance for industrial applications
  • Thermal management requirements
  • Compliance with JEDEC standards

Case study: Data centers prioritizing RDIMM sockets with ECC support for mission-critical servers.

8. Industry Trends

Emerging developments include:

  • Migration to DDR5 interfaces with 6400MT/s+ speeds
  • Miniaturization for mobile device integration
  • Smart sockets with integrated diagnostic capabilities
  • Eco-friendly materials meeting RoHS/REACH regulations

Market forecasts predict 8.2% CAGR through 2030 driven by AI and 5G infrastructure demands.

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