Keystone - Inserts

Image Part Number Description / PDF Quantity Rfq
AX105355-EW

AX105355-EW

Belden

KCONN SIDE ENTRY BOX 6P E-WH

118

AX101314

AX101314

Belden

CAT5E JACK KCONN GREEN TIA606

0

AX101823

AX101823

Belden

RCA MDVO INSERT GRAY WH

0

AX103155

AX103155

Belden

KEYSTONE LC KEYED MODULE

0

AX105352-AL

AX105352-AL

Belden

KCONN SIDE ENTRY BOX 1P ALM

268

AX104182-B24

AX104182-B24

Belden

CAT5E JACK KCONN ORANGE

0

A0644657

A0644657

Belden

BIX DVO OUTLET, SURFACE,

0

AX102112

AX102112

Belden

MDVO LC KEY DUP MM BL-BK

0

AX101071

AX101071

Belden

CAT6+ JACK MDVO BLUE TIA606

0

AX101321-B24

AX101321-B24

Belden

CAT6+ JACK KCONN BLACK

0

AX101842

AX101842

Belden

S-VHS MDVO INSERT,

0

AX101881

AX101881

Belden

MEDIAFLEX SVHS IDC INSER

0

AC303325

AC303325

Belden

MDVO SC SM W/GREEN SHUTTER

0

AX102106

AX102106

Belden

MDVO LC KEY DUP MM BL-WH

0

AX104567

AX104567

Belden

KCONN F-COAX MODULE IVO

0

AX105338-BK

AX105338-BK

Belden

KCONN RCA-WH COUPLER, BLK

0

AX105355-BK

AX105355-BK

Belden

KCONN SIDE ENTRY BOX 6P BLACK

0

AX104184

AX104184

Belden

CAT5E JACK KCONN YELLOW (DARK)

2223

AX102421

AX102421

Belden

KCONN LC DUP SM MODULE, BLK

0

AX104158

AX104158

Belden

10GX JACK KCONN BROWN (DARK)

0

Keystone - Inserts

1. Overview

Keystone inserts are modular interface components designed to facilitate secure and reliable signal or power transmission in structured cabling systems. As standardized interconnect solutions, they serve as fundamental building blocks in telecommunications, networking, and audio/video infrastructure. Their interchangeable design enables rapid deployment and scalability in environments requiring high-density connectivity solutions.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ45 Ethernet8P8C configuration, supports 10/100/1000BASE-T networksNetwork switches, PoE devices
RJ11/126P4C/6P6C configurations, voice/data transmissionTelephony systems, fax machines
Fiber OpticLC/SC/MPO interfaces, single/multi-mode supportData centers, backbone networks
Coaxial75 /50 impedance, RF signal transmissionCCTV systems, satellite receivers
CompositeMulti-protocol integration (HDMI/USB/Power over Ethernet)AV distribution systems

3. Structural Composition

Standard keystone inserts feature a three-part architecture: - Dielectric housing: High-temperature thermoplastic (LCP/PBT) with integrated strain relief - Contact array: Phosphor bronze conductors with 50 " gold plating (25 " minimum standard) - Latching mechanism: Molded polymer actuator with >20N retention force Optional EMI shielding employs 0.1mm thick phosphor bronze cans with 360 coverage.

4. Key Technical Specifications

ParameterValue RangeImportance
Insertion Loss 0.5dB @100MHzSignal integrity maintenance
Contact Resistance10-30m (initial)Power transmission efficiency
Withstand Voltage1000VAC rmsElectrical safety compliance
Mating Cycles750-1500 cyclesService life prediction
Operating Temperature-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecommunications: Central office switching systems, DSLAM cabinets
  • Data Centers: 1U patch panels, high-density fiber distribution
  • Security Systems: IP camera connectivity, access control panels
  • Industrial Automation: PROFINET/Industrial Ethernet nodes
  • Residential: Smart home gateway integration

6. Leading Manufacturers and Products

ManufacturerProduct LineKey Features
TE ConnectivityDEUTSCH DT SeriesIP68-rated, automotive-grade durability
AmphenolOptiCore OCX100Gbps fiber optic transmission
MolexGigabit EthernetShielded Cat6A compliance
Bel StewartPower over Ethernet100W (IEEE 802.3bt) support
PanduitNetKey HDX28% smaller footprint than standard

7. Selection Guidelines

Key selection criteria include: - Signal type and bandwidth requirements (e.g., 25Gbps vs 100Gbps optics) - Environmental factors (temperature, vibration, EMI exposure) - Termination method compatibility (IDC/P CB/Welding) - Regulatory compliance (UL 94V-0, RoHS, REACH) - Cost/performance balance (gold thickness vs cycle life) Actual case: Selecting shielded fiber optic keystone inserts with MPO interfaces for 40Gbps backbone deployment in a Tier III data center.

8. Industry Trends

Current development trends include: - Miniaturization (SFP-DD/OSFP form factors) - Integrated PoE management (smart power negotiation) - Enhanced thermal performance (graphene-enhanced polymers) - Optical engine integration (on-board transceivers) - Sustainability focus (bio-based plastics, 100% recyclable metals)

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