FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
SFW26R-3STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 26POS 1.00MM R/A	3988
SFV14R-2STE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC TOP 14POS 0.50MM R/A	2377
HLW12R-2C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 12POS 1MM R/A	14562
SLW18R-1C7LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 18POS 1.00MM R/A	3813
SFW10S-2STME1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 10POS 1MM SMD	2708
HLW5S-2C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 5POS 1MM PCB	14680
65801-063LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC RCPT 2POS 2.54MM	1691
SFW4S-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 4POS 1MM SMD	0
F519-1A7A1-11004-E200 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	1439
10051922-3010ELF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 30POS 0.50MM R/A	7137
F52R-1A7H1-11026 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	1754
66226-004LF Storage & Server IO (Amphenol ICC)	CONN FFC HEADER 4POS 2.54MM	1164
65801-034LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC RCPT 5POS 2.54MM	432
SLW8S-5C7LF Storage & Server IO (Amphenol ICC)	CONN CIC VERT 8POS 1.00MM PCB	0
66226-005 Storage & Server IO (Amphenol ICC)	CONN FFC HEADER 5POS 2.54MM	0
65801-002LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC RCPT 2POS 2.54MM	0
HLW20S-2C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 20POS 1MM PCB	10132
65801-017LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC RCPT 17POS 2.54MM	74
62684-362100ALF Storage & Server IO (Amphenol ICC)	CONN FPC TOP 36POS 0.50MM R/A	50
F52Q-1A7H1-11020 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	1798

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities