FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
SFV20R-2STE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC TOP 20POS 0.50MM R/A	10579
62674-201121ALF Storage & Server IO (Amphenol ICC)	CONN FFC VERT 20POS 0.50MM SMD	594
66226-010LF Storage & Server IO (Amphenol ICC)	CONN FFC HEADER 10POS 2.54MM	578
F518-1A7A1-11006 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	1494
SLW24S-1C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 24POS 1MM PCB	1496
SLW8R-1C7LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 8POS 1.00MM R/A	1306
62684-36210E9ALF Storage & Server IO (Amphenol ICC)	CONN FPC TOP 36POS 0.50MM R/A	498
62684-322100ALF Storage & Server IO (Amphenol ICC)	CONN FPC TOP 32POS 0.50MM R/A	12341
F518-1A7A1-11023 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	1500
SFV26R-1STE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 26POS 0.50MM R/A	8192
65801-009LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC RCPT 9POS 2.54MM	3633
SLW30S-1C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 30POS 1MM PCB	0
62674-121121ALF Storage & Server IO (Amphenol ICC)	CONN FFC VERT 12POS 0.50MM SMD	0
HLW6S-2C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 6POS 1MM PCB	21315
F51H-1A7H1-11004-B100 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	998
F300-1B7H1-11020-E100 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1998
SLW14R-1C7LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 14POS 1.00MM R/A	3918
SFW15R-1STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 15POS 1.00MM R/A	5785
SFW11S-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 11POS 1MM SMD	0
HFW18S-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 18POS 1MM SMD	678

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities