FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
046841031100846+ KYOCERA Corporation	0.3MM PITCH - 15 POS - VERTICAL	1986
046227010100829+ KYOCERA Corporation	1.0MM PITCH - 10 POS - RT ANGLE	2841
046892640101846+ KYOCERA Corporation	0.5MM PITCH - 40 POS - RT ANGLE	1059
046844731002846+ KYOCERA Corporation	0.3MM PITCH - 31 POS - RT ANGLE	4973
046232112015800 KYOCERA Corporation	CONN FFC FPC VERT 12POS 1MM SMD	0
046244422010846+ KYOCERA Corporation	0.5MM PITCH - 22 POS - VERTICAL	4488
046251045010846+ KYOCERA Corporation	0.5MM PITCH - 45 POS - VERTICAL	758
046288050000846+ KYOCERA Corporation	CONN FFC BOTTOM 50POS 0.50MM R/A	4248
046293609005829+ KYOCERA Corporation	0.3MM PITCH - 09 POS - RT ANGLE	1973
006208516210000+ KYOCERA Corporation	CONN FFC FPC VERT 16POS 1MM SMD	0
046214016010846+ KYOCERA Corporation	0.5MM PITCH - 16 POS - VERTICAL	1335
046244430010846+ KYOCERA Corporation	0.5MM PITCH - 30 POS - VERTICAL	4497
046809624210846+ KYOCERA Corporation	0.5MM PITCH - 24 POS - RT ANGLE	3963
046293617005829+ KYOCERA Corporation	0.3MM PITCH - 17 POS - RT ANGLE	1960
04 6806 012 000 846+ KYOCERA Corporation	FPC/FFC CONNECTOR	1934
006207341914000+ KYOCERA Corporation	CONN FFC FPC 14POS 1.25MM R/A	20944
046214010010846+ KYOCERA Corporation	0.5MM PITCH - 10 POS - VERTICAL	1294
006208506110000+ KYOCERA Corporation	CONN FFC FPC VERT 6POS 1MM SMD	0
046284020002846+ KYOCERA Corporation	0.5MM PITCH - 20 POS - RT ANGLE	2033
046293635005829+ KYOCERA Corporation	0.3MM PITCH - 35 POS - RT ANGLE	1770

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities