FFC, FPC (Flat Flexible) Connectors

Image	Part Number	Description / PDF	Quantity	Rfq
	2004850670 Woodhead - Molex	0.5 ONE-TOUCH RA 70P GND	0
	0015474080 Woodhead - Molex	CONN CIC FFC RCPT 8POS 2.54MM	0
	0015388180 Woodhead - Molex	CONN CIC FFC RCPT 18POS 2.54MM	0
	0528072110 Woodhead - Molex	CONN FPC TOP 21POS 1.00MM R/A	0
	5033005310 Woodhead - Molex	CONN FPC TOP 53POS 0.25MM R/A	0
	2005280250 Woodhead - Molex	1.0 FPC ZIF BTM CONT EMBT PKG 25	0
	0781271369 Woodhead - Molex	CONN FFC VERT 36POS 0.50MM SMD	0
	0541043833 Woodhead - Molex	CONN FFC TOP 38POS 0.50MM R/A	0
	0541044331 Woodhead - Molex	0.5 FPC ZIF SMT R/AUPRCONT43CKTE	0
	0015388090 Woodhead - Molex	CONN CIC FFC RCPT 9POS 2.54MM	0
	0015388209 Woodhead - Molex	CONN CIC FFC RCPT 20POS 2.54MM	0
	5019510430 Woodhead - Molex	0.5 FPC HSG ASSY EASYONST4CKTEMB	0
	0528082571 Woodhead - Molex	CONN FFC FPC VERT 25POS 1MM SMD	0
	0015389152 Woodhead - Molex	CONN CIC FFC PLUG 15POS 2.54MM	0
	2004850240 Woodhead - Molex	0.5 ONE-TOUCH RA 40P HT GND	0
	5047541540 Woodhead - Molex	0.3 FPC B/F HITEMP W/LCK 15CKTEM	0
	0781271349 Woodhead - Molex	CONN FFC VERT 34POS 0.50MM SMD	0
	5047544120 Woodhead - Molex	CONN FPC 41POS .3MM SMD R/A	0
	2004850730 Woodhead - Molex	0.5 ONE-TOUCH ST 30P GND	0
	2004850220 Woodhead - Molex	0.5 ONE-TOUCH RA 20P HT GND	0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities