ample-chip ample-chip
RFQ
BOM

FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
5051103091

5051103091

Woodhead - Molex

CONN FFC/FPC BOTTOM 30P .5MM R/A

1293
0528082971

0528082971

Woodhead - Molex

CONN FFC FPC VERT 29POS 1MM SMD

0
5051101992

5051101992

Woodhead - Molex

CONN FPC BOTTOM 19POS .5MM R/A

3126
2005280050

2005280050

Woodhead - Molex

1.0 FPC ZIF BTM CONT EMBT PKG 5C

16284
0522072433

0522072433

Woodhead - Molex

CONN FFC FPC TOP 24POS 1MM R/A

2465
503566-4100

503566-4100

Woodhead - Molex

CONN FPC BOTTOM 41POS 0.30MM R/A

527
0514411293

0514411293

Woodhead - Molex

CONN FFC BOTTOM 12POS 0.50MM R/A

7645
0524372471

0524372471

Woodhead - Molex

CONN FFC BOTTOM 24POS 0.50MM R/A

257
0039532054

0039532054

Woodhead - Molex

CONN FFC FPC TOP 5POS 1.25MM R/A

586
0526102034

0526102034

Woodhead - Molex

CONN FPC VERT 20POS 1.00MM SMD

2936
0525591233

0525591233

Woodhead - Molex

CONN FFC VERT 12POS 0.50MM SMD

203
0015474121

0015474121

Woodhead - Molex

CONN CIC FFC RCPT 12POS 2.54MM

0
0781272220

0781272220

Woodhead - Molex

CONN 0.5 FPC ZIF ST AU TP 22CKT

0
0015474074

0015474074

Woodhead - Molex

CONN CIC FFC RCPT 7POS 2.54MM

0
0545501833

0545501833

Woodhead - Molex

CONN FFC TOP 18POS 0.50MM R/A

0
5051102096

5051102096

Woodhead - Molex

CONN FFC/FPC 20POS .5MM SMD R/A

0
0015388169

0015388169

Woodhead - Molex

CONN CIC FFC RCPT 16POS 2.54MM

0
0015475100

0015475100

Woodhead - Molex

CONN FFC PLUG 10POS 2.54MM

0
0526102534

0526102534

Woodhead - Molex

CONN FPC VERT 25POS 1.00MM SMD

0
2004850735

2004850735

Woodhead - Molex

0.5 ONE-TOUCH ST 35P GND

0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
RFQ BOM Call Skype Email
Top