FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
FH52-60S-0.5SH(99) Hirose	CONN FFC BOTTOM 60POS 0.50MM R/A	460
0541323462 Woodhead - Molex	CONN FFC BOTTOM 34POS 0.50MM R/A	5623
FH12-12S-0.5SH(1)(98) Hirose	CONN FFC BOTTOM 12POS 0.50MM R/A	0
AYF530365T Panasonic	CONN FPC 3POS 0.50MM R/A	0
687118149022 Würth Elektronik Midcom	CONN .5MM HORZ BOTTOM SMD 18POS	1966
2-1734592-4 TE Connectivity AMP Connectors	CONN FPC BOTTOM 24POS 0.50MM R/A	9087
65801-016LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC RCPT 16POS 2.54MM	1845
14FMN-SMT-A-TF(LF)(SN) JST	CONN FFC TOP 14POS 1.00MM R/A	8801
FH19SC-32S-0.5SH(09) Hirose	CONN FFC BOTTOM 32POS 0.50MM R/A	2694
16FLZ-SM2-TB(LF)(SN) JST	CONN FFC TOP 16POS 0.50MM R/A	1611
12FLZ-SM2-TB(LF)(SN) JST	CONN FFC TOP 12POS 0.50MM R/A	6430
5052781233 Woodhead - Molex	0.5 FFC ZIF BTM CONT EMBT PKG 12	369
XF3M-3115-1B Omron Electronics Components	CONN FFC FPC 31POS 0.50MM R/A	1330
0522710679 Woodhead - Molex	CONN FPC BOTTOM 6POS 1.00MM R/A	5827
0525592852 Woodhead - Molex	CONN FFC VERT 28POS 0.50MM SMD	5994
0528523070 Woodhead - Molex	CONN FFC BOTTOM 30POS 1.00MM R/A	5403
F52Q-1A7H1-11006 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	1729
0525592452 Woodhead - Molex	CONN FFC VERT 24POS 0.50MM SMD	32
0015388080 Woodhead - Molex	CONN CIC FFC RCPT 8POS 2.54MM	0
FA1004SA1-R8000 JAE Electronics	CONN FPC 4POS 0.50MM R/A	4857

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities