FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
0039532135 Woodhead - Molex	CONN FFC VERT 13POS 1.25MM PCB	6002
FH33J-12S-0.5SH(10) Hirose	CONN FFC BOTTOM 12POS 0.50MM R/A	833
FH28E-40S-0.5SH(07) Hirose	CONN FFC BOTTOM 40POS 0.50MM R/A	0
1-84984-4 TE Connectivity AMP Connectors	CONN FFC FPC VERT 14POS 1MM PCB	0
0545480871 Woodhead - Molex	CONN FFC BOTTOM 8POS 0.50MM R/A	0
0525591052 Woodhead - Molex	CONN FFC VERT 10POS 0.50MM SMD	1602542000
TF38-26S-0.5SV(830) Hirose	CONN FFC 26POS 0.50MM SMD	6297
FC1-20-02-T-WT Samtec, Inc.	1MM SINGLE ROW CONNECTOR	60
FH42-23S-0.3SHW(99) Hirose	CONN FPC TOP 23POS 0.30MM R/A	23
5034800800 Woodhead - Molex	CONN FFC FPC 8POS 0.50MM R/A	2147483647
0524352433 Woodhead - Molex	CONN FFC TOP 24POS 0.50MM R/A	4000
5051102891 Woodhead - Molex	CONN FFC/FPC BOTTOM 28P .5MM R/A	11726
1734839-5 TE Connectivity AMP Connectors	CONN FPC TOP 5POS 0.50MM R/A	13868
1735042-6 TE Connectivity AMP Connectors	CONN FFC FPC VERT 6POS 1MM SMD	11319
0522713069 Woodhead - Molex	CONN FPC BOTTOM 30POS 1.00MM R/A	809
0520451045 Woodhead - Molex	CONN FFC VERT 10POS 1.25MM PCB	833
0522073433 Woodhead - Molex	CONN FFC FPC TOP 34POS 1MM R/A	1045
XF2L-1325-1A Omron Electronics Components	CONN FPC TOP 13POS 0.50MM R/A	69
68612214422 Würth Elektronik Midcom	CONN FPC BOTTOM 22POS 1.00MM R/A	1235
FFC3B11-09-T Global Connector Technology, Limited (GCT)	09W, 1.0MM FFC CONN, R/A,TOP CON	2907

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities