D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120793

1731120793

Woodhead - Molex

FCT TERM HFREQ

0

1731120717

1731120717

Woodhead - Molex

'FCT SIGN PLG CRP 20-24AWG 30U''

0

1731120340

1731120340

Woodhead - Molex

FCT TERM HPWR RA PC PLG 30 AMP

0

1731120738

1731120738

Woodhead - Molex

'FCT HD SIGN PLG CRP 22-28AWG 30

0

1731120745

1731120745

Woodhead - Molex

RCPT FCT CRP 22-28AWG 30U

0

1731120642

1731120642

Woodhead - Molex

FCT TERM SIGN STAMPED RCPT CRP 2

0

1731120396

1731120396

Woodhead - Molex

FCT TERM HPWR STR PC RCPT 40 AMP

0

1731120231

1731120231

Woodhead - Molex

HIGH CURRENT PCB ANGLED CONTACT

0

1731120899

1731120899

Woodhead - Molex

FCT TERM HPWR

0

1731120827

1731120827

Woodhead - Molex

COAX PCB STAIGHT CONTACT 50 OHM

0

1731120179

1731120179

Woodhead - Molex

CONN D-SUB SOCKET COAX CRIMP

0

1731120921

1731120921

Woodhead - Molex

FCT TERM HFREQ

0

0709841013

0709841013

Woodhead - Molex

CONN D-SUB PIN 28-36AWG SLDR

0

1731120680

1731120680

Woodhead - Molex

FCT TERM HFREQ

0

1731121250

1731121250

Woodhead - Molex

FCT TERM HVOLT

0

1731120895

1731120895

Woodhead - Molex

FCT TERM HPWR

0

0709844008

0709844008

Woodhead - Molex

CONN D-SUB PIN 28-36AWG PCB GOLD

0

0709844009

0709844009

Woodhead - Molex

CONN D-SUB PIN PCB GOLD

0

0717154002

0717154002

Woodhead - Molex

CONN D-SUB PIN PCB GOLD

0

0051251020

0051251020

Woodhead - Molex

CONN D-SUB PIN 28-36AWG PCB GOLD

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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