D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
09670008672580

09670008672580

HARTING

D SUB FE TUR.CR CON 1,3 M AU AWG

0

L17RRD1M1210G

L17RRD1M1210G

Storage & Server IO (Amphenol ICC)

DSUB PIN RR RELEASE CNTCT

0

212558-1

212558-1

TE Connectivity Aerospace Defense and Marine

CONN D-SUB SOCKET/PIN CRIMP GOLD

0

L17DM53745218C309

L17DM53745218C309

Storage & Server IO (Amphenol ICC)

COMBO D-CONTACTS

0

030-50770-11

030-50770-11

JAE Electronics

CONN CONTACT

0

1731120198

1731120198

Woodhead - Molex

CONN D-SUB PIN PCB GOLD

0

1731120152

1731120152

Woodhead - Molex

CONN DSUB SCKT 12-16AWG SLDR CUP

0

09560008375

09560008375

HARTING

D SUB HD MA TURNED CRCONTS4 AW

0

09670008137

09670008137

HARTING

CONN D-SUB PIN 20-24 AWG CRIMP

0

1731120829

1731120829

Woodhead - Molex

COAX PCB STAIGHT CONTACT 50 OHM

0

1731140298

1731140298

Woodhead - Molex

FCT TERM HFREQ SDR RCPT 50 OHM N

0

131A10049X

131A10049X

CONEC

CONN D-SUB PIN 8-10AWG SLDR CUP

0

L17RRD1F11400

L17RRD1F11400

Storage & Server IO (Amphenol ICC)

CONN D-SUB SOCKET 20-24AWG CRIMP

7100

D*C-20-22S-10000

D*C-20-22S-10000

JAE Electronics

CONN DSUB 22POS SOCKET

0

L17DM537425004

L17DM537425004

Storage & Server IO (Amphenol ICC)

COMBO D-CONTACTS

0

030-50635

030-50635

JAE Electronics

CONN D-SUB PIN 20-24AWG CRIMP

0

C330-8997-101D

C330-8997-101D

C&K

330-8997-101-FR022

0

131A12059X

131A12059X

CONEC

CONN D-SUB PIN SLDR GOLD

0

1731120838

1731120838

Woodhead - Molex

FCT TERM HPWR

0

L17HRD2F125K

L17HRD2F125K

Storage & Server IO (Amphenol ICC)

D SUB -REAR RELEASE CONTACTS

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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