| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
TE Connectivity AMP Connectors |
CONN CASSETTE 33POS RCPT KIT 4PC |
0 |
|
|
TE Connectivity AMP Connectors |
RETAINER, RECPT, ACTION PIN |
0 |
|
|
TE Connectivity AMP Connectors |
CONN CHAMP INSIDE SHIELD 36POS |
0 |
|
|
TE Connectivity AMP Connectors |
CONN CHAMP DUST COVER 64POS |
0 |
|
|
TE Connectivity AMP Connectors |
INSIDE SHLD, EMI, PLUG, 50 POS |
0 |
|
|
TE Connectivity AMP Connectors |
COVER, .050/.085, CHAMP |
0 |
|
|
TE Connectivity AMP Connectors |
CONN LATCH BLOCK .050 SERIES |
0 |
|
|
TE Connectivity AMP Connectors |
CONN TERM COVER 28POS .050 |
0 |
|
|
TE Connectivity AMP Connectors |
CONN D-SUB GASKET RFI 9POS TIN |
0 |
|
|
TE Connectivity AMP Connectors |
SLIDE LATCH WITH SCREWS/WASHERS |
0 |
|
|
TE Connectivity AMP Connectors |
COVER, .050/.085, CHAMP |
0 |
|
|
TE Connectivity AMP Connectors |
DOWEL PIN, B/B CHAMP |
0 |
|
|
TE Connectivity AMP Connectors |
COVER,DUST,PLUG, 50 POSN,CHAMP |
0 |
|
|
TE Connectivity AMP Connectors |
ANVIL CONBINATION |
0 |
|
|
TE Connectivity AMP Connectors |
CONN CHAMP INNER FERRULE .5 DIA |
0 |
|
|
TE Connectivity AMP Connectors |
END CAP, AMPLIMITE |
0 |
|
|
TE Connectivity AMP Connectors |
RETAINER, PLUG, ACTION PIN |
0 |
|
|
TE Connectivity AMP Connectors |
SLIDE LATCH |
0 |
|
|
TE Connectivity AMP Connectors |
CONN D-SUB GASKET RFI 15POS TIN |
0 |
|
|
TE Connectivity AMP Connectors |
RS449 LATCH BLOCK KIT |
0 |
|
D-Subminiature (D-Sub) connectors are a family of electrical connectors characterized by a D-shaped metal shielding shell and multiple parallel contacts. They provide reliable signal and power transmission in demanding environments. These connectors remain critical in industrial automation, telecommunications, and legacy computer systems despite emerging alternatives. Their mechanical robustness and customizable configurations ensure continued relevance in specialized applications.
| Type | Key Features | Application Examples |
|---|---|---|
| DB-9 (DE-9) | 9 contacts, compact size | RS-232 serial communication, PC COM ports |
| DB-15 (HD-15) | 15 contacts, high-density | VGA video interfaces, industrial sensors |
| DB-25 | 25 contacts, parallel signaling | Older printer ports, industrial control systems |
| DB-37 | 37 contacts, rugged design | Industrial instrumentation, military equipment |
Standard D-Sub connectors consist of: - Metal shell: Zinc or aluminum alloy housing with EMI shielding - Insulator: High-temperature thermoplastic (e.g., LCP, PBT) - Contacts: Phosphor bronze or beryllium copper with gold/tin plating - Mounting hardware: Threaded nuts or panel-mount flanges Variants include solder cup, PCB mount, and crimp termination options with optional environmental seals.
| Parameter | Typical Range | Significance |
|---|---|---|
| Current Rating | 1-10A per contact | Determines power transmission capability |
| Voltage Rating | 50-600V | Ensures dielectric insulation safety |
| Contact Resistance | 5-20m | Impacts signal integrity |
| Insulation Resistance | 1000M min | Prevents leakage currents |
| Operating Temp | -55 C to +125 C | Defines environmental tolerance |
| Manufacturer | Key Products | Specialization |
|---|---|---|
| TE Connectivity | DEUTSCH D-Sub series | Military/aerospace grade connectors |
| Amphenol | 97-Series D-Subs | High-density industrial connectors |
| Molex | DuraCon D-Sub | Commercial/industrial applications |
| ITT Cannon | Delta-D-Sub | Harsh environment solutions |
Key selection factors: - Signal/power requirements (contact count, current/voltage needs) - Environmental conditions (temperature, vibration, moisture) - Mechanical constraints (panel space, mating cycles) - Shielding requirements (EMI/RFI protection level) - Termination method (solder, crimp, PCB mount) - Compliance standards (MIL-STD, RoHS, REACH) Example: Selecting DB-9 with gold contacts and IP67 rating for outdoor industrial control cabinets.
Emerging trends include: - Miniaturization (e.g., micro D-Sub at 2.5mm pitch) - High-speed variants supporting USB 3.0+ signaling - Integration with fiber optic/hybrid contact designs - Adoption of lead-free plating processes - Modular designs enabling hot-swap functionality - Increased use in IoT edge devices for legacy system compatibility