D-Sub, D-Shaped Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
025-6064-000

025-6064-000

VEAM

DUST CAP FR

0

015-8755-000

015-8755-000

VEAM

D-SUB LOCKING HOOK

0

317-8666-013

317-8666-013

VEAM

MDSM 9 LOCATOR

0

253-0367-003

253-0367-003

VEAM

DSUB STANDOFF STAINLESS STEEL

0

025-9535-002

025-9535-002

VEAM

DUST CAP MDM37S ELEC-STATIC

0

GDD111631-38

GDD111631-38

VEAM

DSUB GROMMET

0

DE-60-20PG

DE-60-20PG

VEAM

DSUB DUSTCAP DE PIN

0

D110550-2

D110550-2

VEAM

DSUB J/S ASSEMBLY NO LOCTITE

1848

253-0343-011

253-0343-011

VEAM

DSUB D*MA SPACER

0

DD24661-4

DD24661-4

VEAM

DSUB DD DEEP STRT B/S BRASS

0

217-0607-028

217-0607-028

VEAM

BFR 28 HEX NUT

0

980-2000-078

980-2000-078

VEAM

DSUB MYLAR WASHER

97

DB24659-15

DB24659-15

VEAM

DSUB DB DEEP STRT B/S BRASS NM

0

DA20961-16

DA20961-16

VEAM

DSUB DA B/S ROUND CLAMP NM

0

DBS-59-20

DBS-59-20

VEAM

DSUB DUST CAP DB SKT BLK A

0

348-8946-000

348-8946-000

VEAM

DSUB SHIELD CAN B TOP

0

D-Sub, D-Shaped Connectors - Accessories

1. Overview

D-Subminiature (D-Sub) connectors are a family of electrical connectors characterized by a D-shaped metal shielding shell and multiple parallel contacts. They provide reliable signal and power transmission in demanding environments. These connectors remain critical in industrial automation, telecommunications, and legacy computer systems despite emerging alternatives. Their mechanical robustness and customizable configurations ensure continued relevance in specialized applications.

2. Main Types and Functional Classification

TypeKey FeaturesApplication Examples
DB-9 (DE-9)9 contacts, compact sizeRS-232 serial communication, PC COM ports
DB-15 (HD-15)15 contacts, high-densityVGA video interfaces, industrial sensors
DB-2525 contacts, parallel signalingOlder printer ports, industrial control systems
DB-3737 contacts, rugged designIndustrial instrumentation, military equipment

3. Structure and Components

Standard D-Sub connectors consist of: - Metal shell: Zinc or aluminum alloy housing with EMI shielding - Insulator: High-temperature thermoplastic (e.g., LCP, PBT) - Contacts: Phosphor bronze or beryllium copper with gold/tin plating - Mounting hardware: Threaded nuts or panel-mount flanges Variants include solder cup, PCB mount, and crimp termination options with optional environmental seals.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-10A per contactDetermines power transmission capability
Voltage Rating50-600VEnsures dielectric insulation safety
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance1000M minPrevents leakage currents
Operating Temp-55 C to +125 CDefines environmental tolerance

5. Application Fields

  • Computer Systems: Legacy serial/parallel ports, KVM switches
  • Industrial Automation: PLC interfaces, sensor/actuator connections
  • Telecommunications: Router/console ports, test equipment
  • Medical Devices: Diagnostic equipment data interfaces
  • Aerospace: Avionics control systems, ground support equipment

6. Leading Manufacturers and Products

ManufacturerKey ProductsSpecialization
TE ConnectivityDEUTSCH D-Sub seriesMilitary/aerospace grade connectors
Amphenol97-Series D-SubsHigh-density industrial connectors
MolexDuraCon D-SubCommercial/industrial applications
ITT CannonDelta-D-SubHarsh environment solutions

7. Selection Guidelines

Key selection factors: - Signal/power requirements (contact count, current/voltage needs) - Environmental conditions (temperature, vibration, moisture) - Mechanical constraints (panel space, mating cycles) - Shielding requirements (EMI/RFI protection level) - Termination method (solder, crimp, PCB mount) - Compliance standards (MIL-STD, RoHS, REACH) Example: Selecting DB-9 with gold contacts and IP67 rating for outdoor industrial control cabinets.

8. Industry Trends

Emerging trends include: - Miniaturization (e.g., micro D-Sub at 2.5mm pitch) - High-speed variants supporting USB 3.0+ signaling - Integration with fiber optic/hybrid contact designs - Adoption of lead-free plating processes - Modular designs enabling hot-swap functionality - Increased use in IoT edge devices for legacy system compatibility

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