D-Shaped Connectors - Centronics

Image Part Number Description / PDF Quantity Rfq
10168-6000EC

10168-6000EC

3M

CONN PLUG 68POS STR IDC

208

2-5175887-7

2-5175887-7

TE Connectivity AMP Connectors

CONN RCPT 50POS PCB SOLDER

0

111-036-203L001

111-036-203L001

NorComp

CONN SCSI RCPT 36P STR SLDR CUP

585

10226-0210EC

10226-0210EC

3M

CONN RCPT 26POS STR IDC

111

FX2CA1-52P-1.27DSA(71)

FX2CA1-52P-1.27DSA(71)

Hirose

CONN HEADER VERT 52POS 1.27MM

0

1-1734100-1

1-1734100-1

TE Connectivity AMP Connectors

CONN BTB PLUG 100POS VERT SOLDER

0

DX10A-100S(50)

DX10A-100S(50)

Hirose

CONN PLUG 100POS RA

0

FX2BA-40SA-1.27R

FX2BA-40SA-1.27R

Hirose

CONN SOCKET 40POS 1.27MM (4PCS)

41

3366-1002

3366-1002

3M

CONN PLUG 36POS STR IDC

0

DX33A-100S-LNA(50)

DX33A-100S-LNA(50)

Hirose

CONN RECEPT 100POS

0

12250-5150-00FR

12250-5150-00FR

3M

CONN RCPT 50POS R/A SOLDER

100

FX2B-60P-1.27DSL(71)

FX2B-60P-1.27DSL(71)

Hirose

CONN HDR 60POS 1.27MM

0

10226-55G3PL

10226-55G3PL

3M

CONN RCPT 26POS R/A SOLDER

581

FX2CA2-80S-1.27DSA(71)

FX2CA2-80S-1.27DSA(71)

Hirose

CONN RECEPT VERT 80POS 1.27MM

5

DX20M-26S(50)

DX20M-26S(50)

Hirose

CONN MINI HD RCPT 26P PCB SOLDER

0

0714300008

0714300008

Woodhead - Molex

CONN VHDCI RCPT 68POS R/A SOLDER

1448

FX2-20P-0.635SH(95)

FX2-20P-0.635SH(95)

Hirose

CONN HDR 20POS 1.27MM

458

1734037-1

1734037-1

TE Connectivity AMP Connectors

CONN BTB RCPT 80POS R/A SOLDER

1494

111-014-203L001

111-014-203L001

NorComp

CONN SCSI RCPT 14P STR SLDR CUP

795

DX40-36P(55)

DX40-36P(55)

Hirose

CONN PLUG 36POS

0

D-Shaped Connectors - Centronics

1. Overview

D-Shaped connectors, named for their distinctive trapezoidal metal shield, are widely used in computing and industrial applications. The Centronics interface, a subset of D-shaped connectors, was originally developed by Centronics Data Computer Corp. for parallel printing. These connectors enable robust electrical and mechanical connections, playing a critical role in legacy systems and specialized industrial equipment despite the rise of USB and wireless technologies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Standard Centronics36-pin configuration, unshielded, 5A max currentLegacy inkjet/dot matrix printers
High-Density Centronics50-pin configuration, improved EMI shieldingIndustrial automation systems
Locking CentronicsThreaded screws for vibration resistanceMedical imaging equipment

3. Structure and Composition

Centronics connectors feature: - Metal shell (zinc alloy or aluminum) for EMI protection - Insulating housing (high-temperature nylon) - Contact pins (phosphor bronze with gold plating) - Screw locking mechanism (optional) The standard 36-pin design includes 20 signal pins and 16 ground pins, arranged in staggered rows to prevent misalignment.

4. Key Technical Specifications

ParameterValue/RangeImportance
Pin Count24-50 pinsDetermines data transmission capacity
Current Rating1-10A per pinDefines power handling capability
Contact Resistance 10m Ensures signal integrity
Dielectric Strength1000VAC rmsPrevents electrical breakdown
Operating Temperature-40 C to +85 CGuarantees performance stability

5. Application Fields

Major industries include: - Office equipment (printers, scanners) - Industrial automation (CNC machines, PLCs) - Medical devices (diagnostic equipment) - Legacy military systems - Test & measurement instruments

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
AmphenolCentronics 36-8051 Series
Molex50-87-1360 High-Density Connector
TE ConnectivityDuraCon Centronics 24

7. Selection Guidelines

Key considerations: - Match pin count and spacing (0.05"-0.1" pitch) - Choose appropriate current rating with 20% safety margin - Select locking mechanism type (standard screws vs. quick-release) - Confirm environmental ratings (IP40 minimum for industrial) - Verify compatibility with existing cabling infrastructure

8. Industry Trends

Current trends include: - Transition to hybrid connectors supporting USB-C and Ethernet - Development of miniaturized D-sub variants (e.g., Micro-Centronics) - Increased adoption of gold-plated contacts for high-reliability applications - Phasing out in consumer electronics, but stable demand in industrial sectors - Integration with PoE (Power over Ethernet) systems for combined data/power delivery

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