Contacts, Spring Loaded (Pogo Pins), and Pressure

Image Part Number Description / PDF Quantity Rfq
H057DL1A-1K

H057DL1A-1K

Plastronics Sockets & Connectors

SPRING PROBE .57MM X 3.80MM HPIN

20

S70-332002045R

S70-332002045R

Harwin

CONTACT SMD GOLD

1695

0907-1-15-20-75-14-11-0

0907-1-15-20-75-14-11-0

Mill-Max

CONTACT SPRING LOADED SMD GOLD

4718

2429

2429

Adafruit

CONTACT SPRING LOADED SMD 10PC

0

0911-0-15-20-86-14-11-0

0911-0-15-20-86-14-11-0

Mill-Max

CONTACT SPRING LOADED SMD GOLD

10038

0959-0-54-20-75-14-11-0

0959-0-54-20-75-14-11-0

Mill-Max

CONTACT SPRING LOADED IN-LINE

1235

0914-3-15-20-77-14-11-0

0914-3-15-20-77-14-11-0

Mill-Max

CONTACT SPRING LOADED T/H GOLD

3109

90158-AS

90158-AS

Preci-Dip

CONTACT SPRING LOADED SMD GOLD

5470

P1113CA3

P1113CA3

Harwin

CONTACT SPRING LOADED T/H GOLD

685

PRT-09173

PRT-09173

SparkFun

CONTACT SPRING LOADED T/H GOLD

0

0907-2-15-20-75-14-11-0

0907-2-15-20-75-14-11-0

Mill-Max

CONTACT SPRING LOADED SMD GOLD

47238

S70-220101045R

S70-220101045R

Harwin

CONTACT SMD GOLD

3638

0908-4-15-20-75-14-11-0

0908-4-15-20-75-14-11-0

Mill-Max

CONTACT SPRING LOADED T/H GOLD

31914

H033DL2A-1C

H033DL2A-1C

Plastronics Sockets & Connectors

SPRING PROBE .33MM X 3.81MM HPIN

200

0861-0-15-20-82-14-11-0

0861-0-15-20-82-14-11-0

Mill-Max

CONTACT SPRING LOADED T/H GOLD

7599

0932-0-15-20-77-14-11-0

0932-0-15-20-77-14-11-0

Mill-Max

CONTACT SPRING LOADED T/H GOLD

4456

0990-3-50-20-75-14-11-0

0990-3-50-20-75-14-11-0

Mill-Max

CONTACT SPRING LOADED SMD GOLD

0

807-22-001-10-003101

807-22-001-10-003101

Mill-Max

CONTACT SPRING LOADED T/H GOLD

821

P70-2010045R

P70-2010045R

Harwin

CONTACT SPRING LOADED SMD GOLD

2962

T033LT1A-1C

T033LT1A-1C

Plastronics Sockets & Connectors

SPRING PROBE .33MM X 1.26MM HPIN

200

Contacts, Spring Loaded (Pogo Pins), and Pressure

1. Overview

Connectors and interconnect contacts are critical components enabling electrical and mechanical connections in electronic systems. Spring-loaded contacts (Pogo Pins) utilize a compressible spring mechanism to maintain stable contact force under pressure, ensuring reliable signal and power transmission. These components are fundamental in applications ranging from consumer electronics to aerospace systems, where durability and performance under dynamic conditions are essential.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Standard Pogo PinsGeneral-purpose design with moderate current capacitySmartphone battery connectors
High-Current Pogo PinsLarge diameter and low-resistance materialsElectric vehicle charging interfaces
High-Frequency Pogo PinsControlled impedance and minimized inductance5G base station testing equipment
Microminiature Pogo PinsDiameter <1.0mm for compact designsWearable medical devices

3. Structure and Components

A typical spring-loaded contact consists of three main components: (1) Plunger with hard gold-plated tip for low contact resistance, (2) Spring providing axial compression force (typically phosphor bronze or beryllium copper), and (3) Outer barrel with threaded or press-fit mounting options. Advanced designs incorporate anti-rotation features and multi-stage springs for shock absorption. Contact surfaces often use ruthenium or diamond-like carbon coatings for extended wear resistance.

4. Key Technical Parameters

ParameterSignificanceTypical Range
Current RatingDetermines power transmission capacity0.5A-50A
Contact ForceAffects connection stability0.1N-20N
ImpedanceCritical for high-speed signal integrity5-100m
Operating LifeNumber of mating cycles100,000-5,000,000 cycles
Withstanding VoltageSafety and insulation performance50V-1000V

5. Application Fields

Primary industries include:

  • Consumer Electronics: Automated test equipment (ATE), foldable device hinges
  • Automotive: Battery management systems, autonomous driving sensor connectors
  • Medical: Disposable endoscope interfaces, patient monitoring devices
  • Industrial: Robotic arm connectors, CNC machine tool probes
  • Aerospace: Satellite deployment mechanisms, avionics maintenance interfaces

6. Leading Manufacturers and Products

ManufacturerKey ProductsSpecialization
SamtecSEAM Series Micro Pogo PinsHigh-density PCB interconnects
MolexPreci-Flex ContactsHigh-reliability automotive solutions
Everett CharlesEC Series High-Current ProbesSemiconductor testing applications
Ottawa IndustriesHyperboloid ContactsMilitary/aerospace connectors

7. Selection Guidelines

Key considerations include:

  1. Current/voltage requirements vs. contact resistance
  2. Operating environment (temperature, vibration, contamination)
  3. Mating cycle expectations and wear resistance
  4. Size constraints and alignment tolerance
  5. Cost vs. reliability trade-offs
For example, selecting 304 stainless steel springs for corrosion resistance in outdoor medical equipment, or choosing gold-over-nickel plating for low-voltage biomedical sensors.

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-0.5mm diameter contacts for AR/VR devices
  • High-frequency optimization: Gbps+ data rates for 6G testing
  • Smart materials: Shape-memory alloys for self-adjusting contacts
  • Integrated sensors: Built-in force/temperature monitoring
  • Environmental sustainability: Lead-free plating and recyclable materials
The global market is projected to grow at 7.2% CAGR through 2030, driven by EV charging infrastructure and IoT device expansion.

RFQ BOM Call Skype Email
Top