Card Edge Connectors - Edgeboard Connectors

Image Part Number Description / PDF Quantity Rfq
EB43-S0D3040X

EB43-S0D3040X

Vishay / Dale

CONN EDGEBOARD THRU-HOLE

0

EB83-S0A1530X

EB83-S0A1530X

Vishay / Dale

EDGEBOARD CONNECTOR

0

EB83-S0K2240Y-102

EB83-S0K2240Y-102

Vishay / Dale

EDGEBOARD CONNECTOR

0

EB73D-SA1240X-J

EB73D-SA1240X-J

Vishay / Dale

CONN EDGE DUAL FMALE 24POS 0.156

0

EB83-S0K2240Y-101

EB83-S0K2240Y-101

Vishay / Dale

EDGEBOARD CONNECTOR

0

EB65-P0K4430X

EB65-P0K4430X

Vishay / Dale

CONN EDGE DUAL FMALE 88POS 0.125

0

EB81-B0N0670W

EB81-B0N0670W

Vishay / Dale

EDGE CONNECTOR DUAL

0

EB71D-SC3660X

EB71D-SC3660X

Vishay / Dale

CONN EDGE DUAL FMALE 72POS 0.156

0

EB85-S0D2430V

EB85-S0D2430V

Vishay / Dale

EDGEBOARD CONNECTOR

0

EB83-S0L2240W-101

EB83-S0L2240W-101

Vishay / Dale

EDGEBOARD CONNECTOR

0

EB41-S0D104XF

EB41-S0D104XF

Vishay / Dale

CONN EDGEBOARD THRU-HOLE

0

EB65-P0E5030X

EB65-P0E5030X

Vishay / Dale

CONN EDGE DUAL FMALE 100POS .125

0

EB43-S0E3040X

EB43-S0E3040X

Vishay / Dale

CONN EDGEBOARD THRU-HOLE

0

EB43-S0D1060W

EB43-S0D1060W

Vishay / Dale

CONN EDGEBOARD THRU-HOLE

0

EB85-S0E2260X

EB85-S0E2260X

Vishay / Dale

EDGEBOARD CONNECTOR

0

EB42-S0E2540W

EB42-S0E2540W

Vishay / Dale

EB42-E25SGFW T02 E2

0

EB41-S3R256FS

EB41-S3R256FS

Vishay / Dale

CONN EDGE DUAL FMALE 50POS 0.100

0

EB43-S0D306XF

EB43-S0D306XF

Vishay / Dale

CONN EDGEBOARD THRU-HOLE

0

EB43-S0K2240X

EB43-S0K2240X

Vishay / Dale

CONN EDGEBOARD THRU-HOLE

0

EB81-P0A2230X

EB81-P0A2230X

Vishay / Dale

EDGEBOARD CONNECTOR

0

Card Edge Connectors - Edgeboard Connectors

1. Overview

Card Edge Connectors, also known as Edgeboard Connectors, are electrical connectors designed to connect printed circuit boards (PCBs) directly to other boards or systems via their edges. These connectors eliminate the need for separate cables or wiring harnesses by utilizing the PCB's edge as both the mechanical support and electrical interface. They play a critical role in modern electronics by enabling compact designs, reliable signal transmission, and modular system architectures.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
PCIe Edge ConnectorsHigh-speed serial communication with low latencyGraphics cards, SSDs, network adapters
DIMM ConnectorsParallel data transfer for memory modulesDesktop/server RAM modules
SATA Edge ConnectorsSerial data transfer with hot-swapping capabilityHDDs, SSDs, optical drives
USB Type-C Edge ConnectorsBidirectional 24-pin configuration with power deliveryLaptops, mobile devices, docking stations

3. Structure and Components

Typical card edge connectors consist of: - Contact Points: Phosphor bronze or beryllium copper with gold-plated surfaces (10-50 m thickness) for low resistance - Insulation Body: High-temperature resistant LCP or nylon materials (UL94 V-0 rated) - Retention Mechanism: Integrated latches or screws for vibration resistance - PCB Interface: Precision-machined slots with alignment guides ( 0.05mm tolerance) - Shielding Layer: EMI-suppressing metal shells for high-frequency applications

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance5-20m Ensures minimal signal loss
Current Rating1-5A per contactDetermines power delivery capacity
Dielectric Withstanding Voltage500-1000V ACGuarantees electrical safety
Insertion Force20-60NAffects user experience and durability
Operating Temperature-55 C to +125 CDefines environmental adaptability
Mating Cycles500-10,000 cyclesMeasures mechanical longevity

5. Application Fields

  • Computer Systems: Motherboards, expansion cards, memory modules
  • Telecommunications: 5G base stations, network switches
  • Industrial Automation: PLCs, control panels
  • Medical Equipment: MRI scanners, diagnostic devices
  • Consumer Electronics: Smartphones, gaming consoles

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Amphenol ICCSmartSpring PCIe Gen57GHz bandwidth, 0.3mm pitch
TE ConnectivityMEZZOP Edge ConnectorDouble-sided contact design
MolexSL Series DIMM2.0N contact force reduction
SamtecEdge Rate HD0.8mm pitch, 25Gbps per channel

7. Selection Guidelines

Key considerations include: - Signal integrity requirements (frequency vs. crosstalk) - Mechanical constraints (board thickness, spacing) - Environmental conditions (temperature, vibration) - Compliance standards (IPC, RoHS) - Cost-performance balance (gold thickness vs. mating cycles) - Example: For a 10Gbps Ethernet switch, select connectors with controlled impedance (100 10%) and low insertion loss (<0.5dB at 12.5GHz)

8. Industry Trends

Current development directions: - High-density designs (sub-0.5mm pitch) - Enhanced thermal management for 5G applications - Integration with optical interconnects - Surface-mount technology (SMT) adoption - Increased use of conductive polymers for contact materials - Development of self-aligning connectors for automated assembly

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