Backplane Connectors - Hard Metric, Standard

Image Part Number Description / PDF Quantity Rfq
5646547-1

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TE Connectivity AMP Connectors

CONN RECEPT 138POS 2MM PRESS-FIT

178

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TE Connectivity AMP Connectors

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121

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0

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TE Connectivity AMP Connectors

CONN HEADER 154POS 2MM PRESS-FIT

83

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TE Connectivity AMP Connectors

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815

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352068-1

TE Connectivity AMP Connectors

CONN RECEPT 110POS 2MM PRESS-FIT

487

6645141-1

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TE Connectivity AMP Connectors

CONN HEADER 110POS 2MM PRESS-FIT

860

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5646529-1

TE Connectivity AMP Connectors

CONN HEADER 169POS 2MM PRESS-FIT

1989

5188256-1

5188256-1

TE Connectivity AMP Connectors

CONN HEADER 175POS 2MM PRESS-FIT

265

352171-1

352171-1

TE Connectivity AMP Connectors

CONN RECEPT 95POS 2MM PRESS-FIT

419

5646759-1

5646759-1

TE Connectivity AMP Connectors

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49

5106509-1

5106509-1

TE Connectivity AMP Connectors

CONN HEADER 154POS 2MM PRESS-FIT

80

5106303-1

5106303-1

TE Connectivity AMP Connectors

CONN HEADER 55POS 2MM PRESS-FIT

318

1-5106081-9

1-5106081-9

TE Connectivity AMP Connectors

CONN HEADER 77POS 2MM PRESS-FIT

0

5100145-1

5100145-1

TE Connectivity AMP Connectors

CONN RECEPT 125POS 2MM PRESS-FIT

304

5352457-1

5352457-1

TE Connectivity AMP Connectors

CONN RECEPT 110POS 2MM PRESS-FIT

476

100668-1

100668-1

TE Connectivity AMP Connectors

CONN HEADER 154POS 2MM PRESS-FIT

121

5352152-4

5352152-4

TE Connectivity AMP Connectors

CONN RECEPT 120POS 2MM PRESS-FIT

562

5646486-1

5646486-1

TE Connectivity AMP Connectors

CONN RECEPT 176POS 2MM PRESS-FIT

72

5352332-1

5352332-1

TE Connectivity AMP Connectors

CONN HEADER 154POS 2MM PRESS-FIT

360

Backplane Connectors - Hard Metric, Standard

1. Overview

Hard Metric Standard Backplane Connectors are precision-engineered electrical components designed for high-density interconnection in complex systems. Defined by their standardized 2.54mm (0.1") grid spacing, these connectors ensure mechanical and electrical compatibility across generations of equipment. Their importance in modern technology stems from enabling scalable, high-reliability architectures in telecommunications, industrial automation, and mission-critical computing systems.

2. Main Types & Functional Classification

TypeKey FeaturesApplications
2.54mm Hard MetricStandardized pitch, 1-6 rows, up to 60A per contactTelecom switches, industrial controllers
2.00mm Hard MetricReduced pitch, enhanced vibration resistanceHigh-density servers, medical imaging
1.27mm Hard MetricUltra-high density, low insertion forceCompact test equipment, aerospace systems

3. Structure & Composition

Typical construction includes: - Insulating housing (LCP/nylon with high thermal stability) - Contact array (phosphor bronze with gold/silver plating) - Polarization keying for mating assurance - EMI shielding via integrated metal frames - Actuation mechanism (lever-assisted or push-pull variants)

4. Key Technical Specifications

ParameterTypical ValueImportance
Current Rating1-60A per contactDetermines power delivery capacity
Contact Resistance 5m Impacts signal integrity
Dielectric Strength1000VACSafety and insulation reliability
Mating Cycles200-2000 cyclesSystem longevity indicator
Operating Temp-55 C to +125 CEnvironmental robustness

5. Application Fields

  • Telecommunications: 5G base stations, optical transport systems
  • Industrial: PLC backplanes, test & measurement equipment
  • Medical: MRI scanners, diagnostic imaging systems
  • Transportation: Rail signaling systems, avionics

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey Features
TE ConnectivityHERMHARD HM2.54mm, 3-row, 3000V isolation
AmphenolHarshIO HMIP67-rated, extreme vibration resistance
MolexMX Hard MetricHigh-speed differential pairs, 25Gbps

7. Selection Guidelines

Key considerations include: - Electrical requirements (current/voltage per contact) - Mechanical constraints (board spacing, mating force) - Environmental conditions (temperature, vibration) - Future scalability (modular design compatibility) - Cost optimization (total lifecycle vs upfront cost)

8. Industry Trends

Emerging developments include: - Integration with optical backplane technology - Increased adoption of 1.27mm pitch for compact systems - Enhanced thermal management solutions - RoHS-compliant plating materials (replacing cadmium) - Smart connectors with integrated diagnostics

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