Backplane Connectors - DIN 41612

Image Part Number Description / PDF Quantity Rfq
168457048002049

168457048002049

Elco (AVX)

CONN DIN HDR 48POS PCB RA GOLD

0

118477030001001

118477030001001

Elco (AVX)

CONN DIN HDR 30POS

0

208477128002049

208477128002049

Elco (AVX)

CONN DIN RCPT 128POS PCB RA GOLD

0

168457128002025

168457128002025

Elco (AVX)

CONN DIN HDR 128POS PCB RA GOLD

0

208483078001025

208483078001025

Elco (AVX)

CONN DIN RCPT 80POS PCB GOLD

0

208447048001001

208447048001001

Elco (AVX)

CONN DIN RCPT 48POS SMD GOLD

0

168457096004025

168457096004025

Elco (AVX)

CONN DIN HDR 96POS PCB RA GOLD

0

108457096004050

108457096004050

Elco (AVX)

CONN DIN HDR 96POS PCB RA GOLD

0

208457096001050

208457096001050

Elco (AVX)

CONN DIN RCPT 96POS PCB GOLD

0

108477064001025

108477064001025

Elco (AVX)

CONN DIN HDR 64POS PCB GOLD

0

108478096101025

108478096101025

Elco (AVX)

CONN DIN HDR 96POS PCB GOLD

0

108458048031025

108458048031025

Elco (AVX)

CONN DIN HDR 48POS PCB RA GOLD

0

128457096002049

128457096002049

Elco (AVX)

CONN DIN HDR 96POS PCB RA GOLD

0

108483042003049

108483042003049

Elco (AVX)

CONN DIN HDR 48POS PCB RA GOLD

0

208484042004049

208484042004049

Elco (AVX)

CONN DIN RCPT 48POS PCB GOLD

0

208458064001025

208458064001025

Elco (AVX)

CONN DIN RCPT 64POS PCB GOLD

0

208477128002025

208477128002025

Elco (AVX)

CONN DIN RCPT 128POS PCB RA GOLD

0

108483024004026

108483024004026

Elco (AVX)

CONN DIN HDR 32POS PCB RA GOLD

0

108457032004025

108457032004025

Elco (AVX)

CONN DIN HDR 32POS PCB RA GOLD

0

208458128003025

208458128003025

Elco (AVX)

CONN DIN RCPT 128POS PCB GOLD

0

Backplane Connectors - DIN 41612

1. Overview

DIN 41612 connectors are standardized electrical connectors defined by the German Institute for Standardization (DIN). They are widely used in industrial electronics, telecommunications, and computer systems for establishing reliable connections between printed circuit boards (PCBs) and backplanes. These connectors enable modular system design, allowing easy maintenance and scalability in complex electronic systems.

2. Main Types & Functional Classification

TypeFunctionApplication Examples
Type ARectangular contacts, 3.2mm pitchGeneral-purpose industrial equipment
Type BDouble-ended contacts for PCB stackingTelecom switching systems
Type CHigh-density 2.54mm pitch contactsData center servers
Type FShielded contacts for high-speed signalsIndustrial automation controllers

3. Structure & Composition

DIN 41612 connectors feature: - Contact System: Phosphor bronze or beryllium copper contacts with gold plating - Insulation Body: Thermoplastic materials (e.g., PA66) with high temperature resistance - Fixing Mechanism: Metal latches and polarization keys to prevent misalignment - Shielding: Optional EMI shielding for high-frequency applications

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power transmission capacity
Contact Resistance 10m Affects signal integrity
Operating Voltage50-250V ACSafety and insulation requirement
Temperature Range-40 C to +125 CEnvironmental reliability
Insertion Force2-10N per contactAssembly and maintenance consideration

5. Application Fields

  • Telecommunications: Switching systems, routers
  • Industrial Automation: PLC controllers, CNC machines
  • Computer Systems: Server racks, mainframe computers
  • Medical Equipment: Diagnostic imaging systems
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Feature
AmphenolDIN41612R32-03232-position high-vibration resistance
TE Connectivity1-1416128Shielded Type F connector
SamtecDIN-41612-3MM3mm pitch miniaturized design
Weidm ller1846030000Corrosion-resistant industrial version

7. Selection Guidelines

  1. Determine current/voltage requirements based on system power budget
  2. Select contact pitch according to PCB space constraints
  3. Consider environmental factors (temperature, humidity, vibration)
  4. Verify compatibility with existing backplane standards
  5. Evaluate shielding needs for high-frequency applications

8. Industry Trends

Key development directions include: - Miniaturization with 2mm pitch connectors entering mainstream adoption - Increased support for high-speed data transmission (>10Gbps) - Integration of hybrid power/signal contact designs - Enhanced materials for RoHS compliance and thermal management - Smart connectors with integrated diagnostic capabilities

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