Backplane Connectors - DIN 41612

Image Part Number Description / PDF Quantity Rfq
536149-5

536149-5

TE Connectivity AMP Connectors

CONN DIN HDR 96POS PCB RA GOLD

0

650908-5

650908-5

TE Connectivity AMP Connectors

CONN DIN PLUG 96POS PCB GOLD

193

09060152912

09060152912

HARTING

CONN DIN HDR 15POS PNL MNT

33

86094648114745V1LF

86094648114745V1LF

Storage & Server IO (Amphenol ICC)

CONN DIN RCPT 96POS PCB GOLD

1

364914

364914

ERNI Electronics

DIN C 64POS M SLDR RA CL2

106

1-1393641-0

1-1393641-0

TE Connectivity AMP Connectors

CONN DIN RCPT 20POS PCB GOLD

0

244294

244294

ERNI Electronics

DIN C 64POS F PFIT 17MM CL2

93

09291306577

09291306577

HARTING

CONN DIN HDR 30POS PCB GOLD

0

208477096002025

208477096002025

Elco (AVX)

CONN DIN RCPT 96POS PCB RA GOLD

43

108458096001026

108458096001026

Elco (AVX)

CONN DIN HDR 96POS PCB RA GOLD

313

PCN10A-64ACP-2.54DS(72)

PCN10A-64ACP-2.54DS(72)

Hirose

CONN DIN HDR 64POS PCB RA GOLD

0

PCN10C-32S-2.54DSA(72)

PCN10C-32S-2.54DSA(72)

Hirose

CONN DIN RCPT 32POS PCB GOLD

374

535090-4

535090-4

TE Connectivity AMP Connectors

CONN DIN RCPT 96POS PCB GOLD

3411

PCN10-48P-2.54DS(72)

PCN10-48P-2.54DS(72)

Hirose

CONN DIN HDR 48POS PCB RA GOLD

77

XC5E64812BYOMR

XC5E64812BYOMR

Omron Electronics Components

CONN DIN PLUG 64POS

0

5650405-5

5650405-5

TE Connectivity AMP Connectors

CONN DIN RCPT 150POS PCB GOLD

130

254978

254978

ERNI Electronics

DIN CD 128POS F SLDR 4.0MM CL2 C

150

09033786901

09033786901

HARTING

CONN DIN HDR 80POS PCB RA

0

650874-5

650874-5

TE Connectivity AMP Connectors

CONN DIN RCPT 120POS PCB RA GOLD

53

148417-5

148417-5

TE Connectivity AMP Connectors

CONN DIN RCPT 80POS PCB GOLD

13

Backplane Connectors - DIN 41612

1. Overview

DIN 41612 connectors are standardized electrical connectors defined by the German Institute for Standardization (DIN). They are widely used in industrial electronics, telecommunications, and computer systems for establishing reliable connections between printed circuit boards (PCBs) and backplanes. These connectors enable modular system design, allowing easy maintenance and scalability in complex electronic systems.

2. Main Types & Functional Classification

TypeFunctionApplication Examples
Type ARectangular contacts, 3.2mm pitchGeneral-purpose industrial equipment
Type BDouble-ended contacts for PCB stackingTelecom switching systems
Type CHigh-density 2.54mm pitch contactsData center servers
Type FShielded contacts for high-speed signalsIndustrial automation controllers

3. Structure & Composition

DIN 41612 connectors feature: - Contact System: Phosphor bronze or beryllium copper contacts with gold plating - Insulation Body: Thermoplastic materials (e.g., PA66) with high temperature resistance - Fixing Mechanism: Metal latches and polarization keys to prevent misalignment - Shielding: Optional EMI shielding for high-frequency applications

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power transmission capacity
Contact Resistance 10m Affects signal integrity
Operating Voltage50-250V ACSafety and insulation requirement
Temperature Range-40 C to +125 CEnvironmental reliability
Insertion Force2-10N per contactAssembly and maintenance consideration

5. Application Fields

  • Telecommunications: Switching systems, routers
  • Industrial Automation: PLC controllers, CNC machines
  • Computer Systems: Server racks, mainframe computers
  • Medical Equipment: Diagnostic imaging systems
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Feature
AmphenolDIN41612R32-03232-position high-vibration resistance
TE Connectivity1-1416128Shielded Type F connector
SamtecDIN-41612-3MM3mm pitch miniaturized design
Weidm ller1846030000Corrosion-resistant industrial version

7. Selection Guidelines

  1. Determine current/voltage requirements based on system power budget
  2. Select contact pitch according to PCB space constraints
  3. Consider environmental factors (temperature, humidity, vibration)
  4. Verify compatibility with existing backplane standards
  5. Evaluate shielding needs for high-frequency applications

8. Industry Trends

Key development directions include: - Miniaturization with 2mm pitch connectors entering mainstream adoption - Increased support for high-speed data transmission (>10Gbps) - Integration of hybrid power/signal contact designs - Enhanced materials for RoHS compliance and thermal management - Smart connectors with integrated diagnostic capabilities

RFQ BOM Call Skype Email
Top