Backplane Connectors - ARINC

Image Part Number Description / PDF Quantity Rfq
DPX2MA-26SA106P-33B-0101

DPX2MA-26SA106P-33B-0101

VEAM

RP DPX2 PLUG W/CLINCH NUTS

0

BKAD2-V155M-40001-F0

BKAD2-V155M-40001-F0

VEAM

RP BKAD2 RECPT

0

BKAE2-234M-40003

BKAE2-234M-40003

VEAM

CONN RCPT ARINC CRIMP

0

DPX2MA-67P106S-34B-0001

DPX2MA-67P106S-34B-0001

VEAM

RP DPX2 RECPT

0

DPX2MA-C2SA106P-33B-0084-FO

DPX2MA-C2SA106P-33B-0084-FO

VEAM

RP DPX2 PLUG

0

DPXB-67-33S-0001

DPXB-67-33S-0001

VEAM

RP DPXB SOLDER PLUG

0

DPXBNE-45M-33S-2302

DPXBNE-45M-33S-2302

VEAM

CONN PLUG ARINC 45M CRIMP

0

DPXAMA-67-34P

DPXAMA-67-34P

VEAM

RP DPXA CRIMP RECPT

0

DPXBMA-67-34P-0101

DPXBMA-67-34P-0101

VEAM

RP DPXB CRIMP RECPT

0

DPX2NE-26MS26MS-33B-00-F0

DPX2NE-26MS26MS-33B-00-F0

VEAM

RP DPX2 PLUG W/FLT MTS

0

BKAD3-B740-400

BKAD3-B740-400

VEAM

RP BKAD3 RECPT

0

248-2780-004

248-2780-004

VEAM

RP BKAE2 PLUG FLT/MT SHELL

0

BKAD3-A740-30001

BKAD3-A740-30001

VEAM

CONN PLUG ARINC CRIMP

0

DPX2-40S40S-33A-0001

DPX2-40S40S-33A-0001

VEAM

RP DPX2 PLUG

0

DPXA-26-34P

DPXA-26-34P

VEAM

RP DPXA SOLDER RECPT

0

BKAF3-A713-409-F0

BKAF3-A713-409-F0

VEAM

RP BKAF3 FRONT RELEASE RECPT

0

DPXBMA-57-33S-0301

DPXBMA-57-33S-0301

VEAM

RP DPXB CRIMP PLUG

0

SGA4D150S0000

SGA4D150S0000

VEAM

RP SINGLE GANG ARINC RECPT

0

BKAD2-A137-32204

BKAD2-A137-32204

VEAM

RP BKAD2 CRIMP PLUG W/GRD SPRG

0

DPX2MA-A106SA106S-34B-0000

DPX2MA-A106SA106S-34B-0000

VEAM

RP DPX2 RECPT

0

Backplane Connectors - ARINC

1. Overview

ARINC backplane connectors are specialized electrical components designed to meet aerospace industry standards set by Aeronautical Radio Inc. (ARINC). Defined by specifications such as ARINC 404 and ARINC 600, these connectors ensure reliable signal transmission in harsh environments. Their modular design and robust mechanical performance make them critical for avionics systems requiring high reliability, including flight control systems, radar equipment, and in-flight communication infrastructure.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ARINC 404 SeriesStandardized rectangular module design, supports up to 100 contactsLegacy aircraft avionics systems
ARINC 600 SeriesEnhanced thermal management, 360 EMI shieldingModern commercial aircraft (e.g., Boeing 787)
ARINC 800 SeriesHigh-speed data transmission (10+ Gbps), fiber optic optionsNext-generation radar systems

3. Structure and Components

Typical ARINC backplane connectors consist of: - Modular housing with MIL-DTL-38999 series III compatibility - Gold-plated copper alloy contacts (0.76-2.8 m plating thickness) - Thermoplastic insulation with UL94 V-0 flammability rating - Aluminum alloy shell with chromate conversion coating - Integrated polarization keys and secondary locking mechanisms

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance 5m Ensures signal integrity
Insulation Resistance 5000M Prevents leakage currents
Operating Temperature-65 C to +150 CSurvives extreme environments
Current Capacity1.5A per contactSupports power distribution
IP RatingIP67Dust/water ingress protection

5. Application Areas

Primary industries include: - Aerospace: Flight management computers, weather radar systems - Defense: Tactical communication systems, missile guidance units - Industrial: High-reliability automation controllers - Transportation: High-speed train control systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Feature
TE ConnectivityARINC 600-2LLiquid cooling integration
Amphenol AerospaceAS7975-600Space-saving stacked design
Delphi Connection SystemsD800-12FHybrid power/signal transmission

7. Selection Guidelines

Key considerations: 1. Environmental requirements (temperature, vibration levels) 2. Signal type (power/data/coaxial combination) 3. Mechanical mating cycles (typically 500+ required) 4. EMI shielding effectiveness ( 60dB at 1GHz) 5. Compliance with DO-160 standards Example: For airborne SATCOM systems, select ARINC 600 connectors with integrated EMI gaskets and fiber optic modules.

8. Industry Trends

Emerging developments: - Integration of optical interfaces (ARINC 810 standard) - Nanocoatings for corrosion resistance - Smart connectors with embedded health monitoring - Increased use of composite materials - Higher speed protocols (100Gbps+ backplane channels)

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