Backplane Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
09060019912

09060019912

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DIN-POWER FIXING BRACKET B RIGHT

0

09068485521500

09068485521500

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DIN-POWER SHELL HOUSING D20 META

0

09060480510200

09060480510200

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DIN-POWER SHELL HOUSING B15

0

09068480535

09068480535

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DIN-POWER SH SET D20 METAL COATL

0

09060009903

09060009903

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DIN-POWER BLANKING PIECE 13 8X16

0

17260004102

17260004102

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HAR-BUS HM SCHIRMBL. R. Z, TYP M

0

17330004102

17330004102

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HAR-BUS HM SCHIRMBL. REIHE Z, TY

0

09030960501200

09030960501200

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DIN-SIGNAL SHELL HOUSING C15

36

09068009902

09068009902

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DIN-POWER BLIND COVER

0

09060009999

09060009999

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DIN-POWER LOCKING SCREW D20

0

16790000017000

16790000017000

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PLUG CONN PCACK-PIN BAS.SIDE 11M

0

09720009903

09720009903

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CODING ELEMENT FOR Q FEMALE AND

0

09060480514510

09060480514510

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DIN-POWER SHELL HOUSING B20

0

09068009960

09068009960

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DIN-POWER COVER SCREW M2 5 X 10

0

09060019924

09060019924

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DIN-POWER FIXING BRACKET BL20

0

02090000018

02090000018

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DIN-SIGNAL HARBUS64 FIXING BRACK

0

09060019972

09060019972

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DIN ISO 7045 - M2 5 X 12 - H - Z

0

09060480509

09060480509

HARTING

DIN-POWER SHELL HOUSING B20

0

09068480534

09068480534

HARTING

DIN-POWER SHELL HOUSING D20 META

0

09060009960

09060009960

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DIN-POWER JUNCTION ELEMENT

0

Backplane Connectors - Accessories

1. Overview

Backplane connectors are critical components in electronic systems, providing modular interconnection between printed circuit boards (PCBs) and supporting high-density signal/power transmission. Accessories enhance their functionality through mechanical support, environmental protection, and performance optimization. These components are essential in telecommunications, data centers, and industrial equipment for ensuring reliable system architecture.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Alignment PinsPrecision-guided insertion, anti-misalignment designTelecom backplanes
Grounding ClipsEMI shielding, 360 contactMilitary radar systems
Dust CoversIP67-rated contamination protectionOutdoor base stations
Mounting BracketsVibration damping, load distributionIndustrial control cabinets
Test AdaptersHot-swappable diagnostics interfaceData center maintenance

3. Structural Composition

Typical construction includes:

  • Mechanical components: Precision-machined alignment guides and stress-relief brackets
  • Electrical elements: Gold-plated contact points and EMI gaskets
  • Material composition: LCP (Liquid Crystal Polymer) insulation with UL94 V-0 rating

4. Key Technical Specifications

ParameterTypical RangeImportance
Current Rating1-5A per contactPower transmission capability
Dielectric Strength1,000-2,500VACElectrical safety margin
Contact Resistance<10m Signal integrity maintenance
Insertion Force20-80NUsability and durability
Operating Temp-55 C to +125 CEnvironmental reliability

5. Application Fields

Primary industries:

  • Telecommunications: 5G base stations, optical switches
  • Data Centers: Server racks, storage arrays
  • Industrial Automation: PLC backplanes
  • Medical Imaging: MRI scanner chassis interconnects
  • Aerospace: Avionics modular systems

6. Leading Manufacturers & Products

ManufacturerKey Product SeriesTechnical Highlights
TE ConnectivityARINC 800H100Gbps optical integration
AmphenolCBGA SocketZero insertion force design
MolexMX-SERIESSelf-aligning twinax contacts
SamtecRaptor HD25.4 m contact spacing

7. Selection Guidelines

Key considerations:

  • Signal integrity requirements (frequency & skew tolerance)
  • Environmental conditions (temperature/humidity/corrosion)
  • Mechanical durability (mating cycles & vibration resistance)
  • Thermal management (current carrying capacity)
  • Compliance standards (IPC, MIL-STD, RoHS)

Case Study: In hyper-scale data centers, Samtec's FireFly modular system reduced rack interconnect costs by 40% while maintaining 28Gbps performance.

8. Industry Trends

Emerging developments include:

  • High-speed protocols (PCIe 5.0, 112Gbps SerDes)
  • Miniaturization (sub-1mm contact pitch)
  • Smart monitoring integration (embedded sensors)
  • Advanced materials (graphene-enhanced contacts)
  • Sustainable manufacturing (lead-free plating processes)
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