Backplane Connectors - Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	677200701403456 Elco (AVX)	CONN BACKPLNE TYPE A 2MM CAD YLW	0
	677200701401248 Elco (AVX)	CONN BACKPLANE TYPE A 2MM RED	0
	677200264300675 Elco (AVX)	CONN SHIELD LOWER TYPE A	0
	308237981000100 Elco (AVX)	COVER ASSMBLY FOR DIN CONN	0
	677200701401236 Elco (AVX)	CONN BACKPLANE TYPE A 2MM BROWN	0
	677200711401278 Elco (AVX)	DAUGHTER CARD TYPE A 2MM CAD YLW	0
	602427301412000 Elco (AVX)	DIN CONN	0
	677200701403478 Elco (AVX)	CONN BACKPLNE TYPE A 2MM BLUE	0
	677200701404678 Elco (AVX)	CONN BACKPLANE TYPE A 2MM YELLOW	0
	308237951001100 Elco (AVX)	COVER ASSMBLY FOR DIN CONN	0
	308237951000300 Elco (AVX)	COVER ASSMBLY FOR DIN CONN	0
	677200711403567 Elco (AVX)	DAUGHTER CARD TYPE A 2MM RED	0

Backplane Connectors - Accessories

1. Overview

Backplane connectors are critical components in electronic systems, providing modular interconnection between printed circuit boards (PCBs) and supporting high-density signal/power transmission. Accessories enhance their functionality through mechanical support, environmental protection, and performance optimization. These components are essential in telecommunications, data centers, and industrial equipment for ensuring reliable system architecture.

2. Major Types & Functional Classification

Type	Functional Features	Application Examples
Alignment Pins	Precision-guided insertion, anti-misalignment design	Telecom backplanes
Grounding Clips	EMI shielding, 360 contact	Military radar systems
Dust Covers	IP67-rated contamination protection	Outdoor base stations
Mounting Brackets	Vibration damping, load distribution	Industrial control cabinets
Test Adapters	Hot-swappable diagnostics interface	Data center maintenance

3. Structural Composition

Typical construction includes:

Mechanical components: Precision-machined alignment guides and stress-relief brackets
Electrical elements: Gold-plated contact points and EMI gaskets
Material composition: LCP (Liquid Crystal Polymer) insulation with UL94 V-0 rating

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	1-5A per contact	Power transmission capability
Dielectric Strength	1,000-2,500VAC	Electrical safety margin
Contact Resistance	<10m	Signal integrity maintenance
Insertion Force	20-80N	Usability and durability
Operating Temp	-55 C to +125 C	Environmental reliability

5. Application Fields

Primary industries:

Telecommunications: 5G base stations, optical switches
Data Centers: Server racks, storage arrays
Industrial Automation: PLC backplanes
Medical Imaging: MRI scanner chassis interconnects
Aerospace: Avionics modular systems

6. Leading Manufacturers & Products

Manufacturer	Key Product Series	Technical Highlights
TE Connectivity	ARINC 800H	100Gbps optical integration
Amphenol	CBGA Socket	Zero insertion force design
Molex	MX-SERIES	Self-aligning twinax contacts
Samtec	Raptor HD	25.4 m contact spacing

7. Selection Guidelines

Key considerations:

Signal integrity requirements (frequency & skew tolerance)
Environmental conditions (temperature/humidity/corrosion)
Mechanical durability (mating cycles & vibration resistance)
Thermal management (current carrying capacity)
Compliance standards (IPC, MIL-STD, RoHS)

Case Study: In hyper-scale data centers, Samtec's FireFly modular system reduced rack interconnect costs by 40% while maintaining 28Gbps performance.

8. Industry Trends

Emerging developments include:

High-speed protocols (PCIe 5.0, 112Gbps SerDes)
Miniaturization (sub-1mm contact pitch)
Smart monitoring integration (embedded sensors)
Advanced materials (graphene-enhanced contacts)
Sustainable manufacturing (lead-free plating processes)