Backplane Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
980-0003-697

980-0003-697

VEAM

RP SCREW-FIL HD 2-56X1/4

0

225-0090-000

225-0090-000

VEAM

RP DPXME REAR REL COAX

0

320-1066-019

320-1066-019

VEAM

RP TERM KIT TCAS RG393

0

177-1001-004

177-1001-004

VEAM

RP BKA 4W4 INS ASSY

0

335-0002-000

335-0002-000

VEAM

RP DPK FEMALE COUPLING NUT ASY

0

320-0023-000

320-0023-000

VEAM

DL1 KIT STAB ADAPTER

0

11457899 REV C

11457899 REV C

VEAM

RP COUPLING SCREW ASSY DPK

0

021-0144-011

021-0144-011

VEAM

RP BKA COAX BODY ASSY

0

025-0585-003

025-0585-003

VEAM

RP DPD 33&34 CONDUCTIVE D/C

0

025-0572-000

025-0572-000

VEAM

RP DPA 59 DUST CAP

0

320-1066-005

320-1066-005

VEAM

RP AA5888 SOLDER TERM KIT

0

320-1069-000

320-1069-000

VEAM

RP DPK GUIDE SOCKET ASSY KIT

0

DPKA-59-1

DPKA-59-1

VEAM

RP DPKA-59-1 CONDUCTIVE D/C

0

225-0099-000

225-0099-000

VEAM

RP BK #5 SKT COAX FILLER PLUG

0

980-0003-271

980-0003-271

VEAM

DL SCREW 4-40

0

980-0006-280

980-0006-280

VEAM

RP SCREW SOC HD CAP

0

025-4506-000

025-4506-000

VEAM

DUST CAP DL1-156R

0

025-0573-000

025-0573-000

VEAM

RP DPA 60 DUST CAP

0

039-0235-000

039-0235-000

VEAM

DL4-1248P COVER

0

320-0025-000

320-0025-000

VEAM

DL2 KIT STAB ADAPTER

0

Backplane Connectors - Accessories

1. Overview

Backplane connectors are critical components in electronic systems, providing modular interconnection between printed circuit boards (PCBs) and supporting high-density signal/power transmission. Accessories enhance their functionality through mechanical support, environmental protection, and performance optimization. These components are essential in telecommunications, data centers, and industrial equipment for ensuring reliable system architecture.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Alignment PinsPrecision-guided insertion, anti-misalignment designTelecom backplanes
Grounding ClipsEMI shielding, 360 contactMilitary radar systems
Dust CoversIP67-rated contamination protectionOutdoor base stations
Mounting BracketsVibration damping, load distributionIndustrial control cabinets
Test AdaptersHot-swappable diagnostics interfaceData center maintenance

3. Structural Composition

Typical construction includes:

  • Mechanical components: Precision-machined alignment guides and stress-relief brackets
  • Electrical elements: Gold-plated contact points and EMI gaskets
  • Material composition: LCP (Liquid Crystal Polymer) insulation with UL94 V-0 rating

4. Key Technical Specifications

ParameterTypical RangeImportance
Current Rating1-5A per contactPower transmission capability
Dielectric Strength1,000-2,500VACElectrical safety margin
Contact Resistance<10m Signal integrity maintenance
Insertion Force20-80NUsability and durability
Operating Temp-55 C to +125 CEnvironmental reliability

5. Application Fields

Primary industries:

  • Telecommunications: 5G base stations, optical switches
  • Data Centers: Server racks, storage arrays
  • Industrial Automation: PLC backplanes
  • Medical Imaging: MRI scanner chassis interconnects
  • Aerospace: Avionics modular systems

6. Leading Manufacturers & Products

ManufacturerKey Product SeriesTechnical Highlights
TE ConnectivityARINC 800H100Gbps optical integration
AmphenolCBGA SocketZero insertion force design
MolexMX-SERIESSelf-aligning twinax contacts
SamtecRaptor HD25.4 m contact spacing

7. Selection Guidelines

Key considerations:

  • Signal integrity requirements (frequency & skew tolerance)
  • Environmental conditions (temperature/humidity/corrosion)
  • Mechanical durability (mating cycles & vibration resistance)
  • Thermal management (current carrying capacity)
  • Compliance standards (IPC, MIL-STD, RoHS)

Case Study: In hyper-scale data centers, Samtec's FireFly modular system reduced rack interconnect costs by 40% while maintaining 28Gbps performance.

8. Industry Trends

Emerging developments include:

  • High-speed protocols (PCIe 5.0, 112Gbps SerDes)
  • Miniaturization (sub-1mm contact pitch)
  • Smart monitoring integration (embedded sensors)
  • Advanced materials (graphene-enhanced contacts)
  • Sustainable manufacturing (lead-free plating processes)
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