TVS - Mixed Technology

Part Number	Description / PDF	Quantity
2906318 Phoenix Contact	VAL-MS+TE-AR 75 VF/P-FM	10
TISP9110MDMR-S J.W. Miller / Bourns	SURGE PROT THYRIST NEG/POS SLIC	10000
TL7726IDR Texas Instruments	IC HEX CLAMPING CIRCUITS 8-SOIC	9836
VM105MK801R040P050 KEMET	VARISTOR 68V 800A RADIAL	0
VK104MM151R004P050 KEMET	VARISTOR 8V 150A RADIAL	0
2905233 Phoenix Contact	PLT-SEC-T3-60-P	10
1840-24-A1 J.W. Miller / Bourns	SURGE PROTECTION DEVICE 24V	0
MAX366ESA+ Maxim Integrated	IC CIRC PROT SIGNAL-LINE 8-SOIC	3051000
2905236 Phoenix Contact	PLT-SEC-T3-3S-230-P	0
VK103MK151R040P050 KEMET	VARISTOR 68V 150A RADIAL	0
B1200CCLRP Wickmann / Littelfuse	BATTRAX SLIC SNGL NEG 400A DO214	0
1669-01 J.W. Miller / Bourns	SIGNAL PROTECT FIELD	0
STF203-15.TCT Semtech	TVS USB 150OHM RES 5.25V SC70-6	4133
TL7726ID Texas Instruments	IC HEX CLAMPING CIRCUIT 8-SOIC	174
41206ESDA-TR1 PowerStor (Eaton)	SUPPRESSOR ESD 12VDC 4/1206 SMD	38959
ECLAMP2522P.TCT Semtech	IC ESD/EMI PROT DIODES	5411
VM155MK801R014P050 KEMET	VARISTOR 24V 800A RADIAL	0
NCP360SNAFT1G	BUFFER/INVERTER BASED PERIPHERAL	47878
TL7726QDRG4 Texas Instruments	TL7726 HEX CLAMPING CIRCUIT	29351
P1701Q22CLRP Wickmann / Littelfuse	SIDAC UNI 160V 500A QFN 3.3 2L	0

TVS - Mixed Technology

1. Overview

Mixed Technology TVS devices combine multiple semiconductor materials and protection mechanisms to achieve superior transient voltage suppression performance. These hybrid solutions integrate silicon-based avalanche diodes, polymer-based ESD protection, and advanced packaging technologies to address complex electromagnetic interference (EMI) challenges in modern electronics. Their importance grows with the increasing demand for reliable protection in high-speed data lines, power systems, and sensitive ICs across industrial, automotive, and consumer applications.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Silicon-Polymer Hybrid TVS	Combines fast silicon diode response with polymer self-recovery capability	USB 3.2 interfaces, HDMI ports
Multi-Layer Varistor-TVS	Stacked silicon layers for multi-stage voltage clamping	Industrial power supplies, 5G base stations
Glass-Passivated Hybrid TVS	Hermetic glass encapsulation with integrated RC filtering	Automotive sensors, medical devices

3. Structure and Composition

Typical mixed technology TVS devices feature a 3D heterogeneous integration structure:

Active layer: Silicon carbide (SiC) or gallium nitride (GaN) semiconductor matrix
Passivation layer: Borosilicate glass or polymer composite
Electrode system: Multi-fingered aluminum-copper hybrid metallization
Thermal management: Embedded graphite heat spreader
Package: Lead-free QFN or DFN with EMI shielding coating

4. Key Technical Parameters

Parameter	Importance
Breakdown Voltage (Vbr)	Determines protection threshold for normal operation
Clamping Voltage (Vc)	Defines maximum voltage transmitted to protected circuit
Response Time (tr)	Measures speed of transition from blocking to conducting state
Power Dissipation (Pppm)	Indicates energy absorption capability during transients
Capacitance (Cj)	Critical for high-speed signal integrity preservation
Operating Temperature	Defines environmental reliability range (-55 C to +150 C typical)

5. Application Fields

Major industries utilizing mixed technology TVS devices include:

Telecommunications: 5G NR base stations, optical transceivers
Industrial Automation: PLC systems, motor drives
Automotive Electronics: CAN-FD interfaces, LiDAR systems
Consumer Devices: Smartphone charging ports, AR/VR headsets

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Littelfuse	SMxxxHCA Series	40kV ESD protection, 0.5pF capacitance, 0.1ns response
STMicroelectronics	TVSH Series	Automotive qualified, AEC-Q101 certified, 300W peak power
Bourns	PGB1 Series	Multi-layer ceramic-silicon hybrid, 10Gbps data rate support

7. Selection Guidelines

Key considerations when selecting mixed technology TVS components:

Match breakdown voltage to system operating voltage (typically 10-15% margin)
Verify clamping voltage compatibility with protected IC's maximum ratings
Consider parasitic capacitance for high-speed (>1Gbps) applications
Evaluate thermal derating curves for intended operating environment
Check compliance with industry standards (IEC 61000-4-2, ISO 10605)
Assess packaging requirements (SMD vs through-hole, board space constraints)

8. Industry Trends

Emerging developments in mixed technology TVS field include:

Integration of AI-based predictive protection algorithms
Development of 3D-printed nanocomposite TVS structures
Adoption of wafer-level packaging for 0.1pF capacitance levels
Implementation of energy recovery features in hybrid architectures
Advancements in terahertz transient suppression materials