Ceramic Capacitors

Image	Part Number	Description / PDF	Quantity	Rfq
	4EX183K2 Semtech	CAP CER 0.018UF 2KV X7R RADIAL	0
	3EX102K5 Semtech	CAP CER 1000PF 5KV X7R RADIAL	0
	2AX272K3 Semtech	CAP CER 2700PF 3KV X7R NONSTND	0
	2EX182K4 Semtech	CAP CER 1800PF 4KV X7R RADIAL	0
	2EX332K1 Semtech	CAP CER 3300PF 1KV X7R RADIAL	0
	4EX124K1 Semtech	CAP CER 0.12UF 1KV X7R RADIAL	0
	3EX682K3 Semtech	CAP CER 6800PF 3KV X7R RADIAL	0
	2EX471K2 Semtech	CAP CER 470PF 2KV X7R RADIAL	0
	5AX153K3 Semtech	CAP CER 0.015UF 3KV X7R NONSTND	0
	4EX333K2 Semtech	CAP CER 0.033UF 2KV X7R RADIAL	0
	3EX272K3 Semtech	CAP CER 2700PF 3KV X7R RADIAL	0
	5EX183K2 Semtech	CAP CER 0.018UF 2KV X7R RADIAL	0
	5AX224K1 Semtech	CAP CER 0.22UF 1KV X7R NONSTND	0
	4AX103K3 Semtech	CAP CER 10000PF 3KV X7R NONSTND	0
	6EX104K2 Semtech	CAP CER 0.1UF 2KV X7R RADIAL	0
	4EX472K5 Semtech	CAP CER 4700PF 5KV X7R RADIAL	0
	2EX222K3 Semtech	CAP CER 2200PF 3KV X7R RADIAL	0

Ceramic Capacitors

1. Overview

Ceramic capacitors are fixed-value capacitors with ceramic materials as dielectrics. They consist of alternating layers of ceramic and metal electrodes, offering compact size, low cost, and stable performance. As core passive components, they are critical in modern electronics for functions like noise filtering, signal coupling, and power supply stabilization. Their importance spans from consumer electronics to aerospace systems due to their reliability and wide operating frequency range.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Class I Ceramic Capacitors	High stability, low losses, linear temperature coefficient ( 30ppm/ C)	RF circuits, precision oscillators
Class II Ceramic Capacitors	Higher capacitance density, nonlinear temperature response ( 15%-22%)	Power decoupling, DC link circuits
Multi-Layer Ceramic Capacitors (MLCCs)	Stacked electrode structure, high capacitance-to-volume ratio	Mobile devices, automotive electronics
High Voltage Ceramic Capacitors	Rated voltage >1kV, thick dielectric layers	Power supplies, medical imaging equipment

3. Structure and Composition

Ceramic capacitors feature a layered structure with three primary components:

Ceramic Dielectric: Barium titanate (BaTiO3) or calcium zirconate formulations for Class II/III types
Electrodes: Nickel, copper, or silver-palladium alloys in alternating layers
Terminations: Solderable outer layers (e.g., tin/nickel plating) for PCB mounting

MLCCs are manufactured through tape casting, screen printing, and sintering processes to create monolithic structures with up to 1000+ electrode layers.

4. Key Technical Specifications

Parameter	Significance	Typical Range
Capacitance (C)	Determines charge storage capability	0.5pF - 100 F
Rated Voltage (VR)	Maximum DC working voltage	2.5V - 10kV
Capacitance Tolerance	Manufacturing accuracy	1% (Class I) to 22% (Class III)
Temperature Coefficient	Stability across temperature	-55 C to +125 C operating range
ESR (Equivalent Series Resistance)	Impacts high-frequency performance	1m - 100m

5. Application Fields

Ceramic capacitors are deployed in:

Consumer Electronics: Smartphones (decoupling), laptops (power management)
Automotive Systems: ECU units (noise suppression), EV charging circuits
Industrial Equipment: Motor drives (snubber circuits), PLC controllers
Telecommunications: 5G base stations (RF filtering), optical transceivers
Medical Devices: MRI scanners (high-voltage isolation), pacemakers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Technical Highlights
Murata Manufacturing	GRM series MLCCs	Sub-millimeter 0201 size with 10 F capacity
TDK Corporation	C4532 series	High-reliability automotive grade components
KEMET Electronics	C1210 series	Space-grade tantalum ceramic hybrid capacitors
AVX Corporation	943D series	High-voltage 2000V surface-mount devices
Vishay Intertechnology	VCB series	Anti-sulfurated terminations for harsh environments

7. Selection Guidelines

Key considerations for capacitor selection:

Operating voltage margin (>20% above rated voltage)
Temperature stability requirements (Class I for precision circuits)
Size constraints (MLCCs preferred for miniaturization)
Environmental factors (humidity, vibration, thermal cycling)
Cost optimization (Class II for cost-sensitive applications)

Example: For a 5G RF front-end module, select Class I capacitors with 0.1pF tolerance and 50 impedance matching characteristics.

8. Industry Trends

Emerging developments include:

Miniaturization: Development of 01005-inch MLCCs for wearable devices
High Capacitance Density: 100 F+ in 1210 package through nano-dielectric engineering
Advanced Materials: Lead-free ceramics meeting RoHS standards
High-Temperature Performance: Capacitors operating reliably at 200 C+
Integrated Solutions: Embedded capacitor substrates for SiP (System-in-Package) applications