Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A02KR02KR26E102A

A02KR02KR26E102A

JST

JUMPER 02KR-6S-P - 02KR-6S-P 4"

1585

A06XSR06XSR36R152B

A06XSR06XSR36R152B

JST

JUMPER 06XSR-36S - 06XSR-36S 6"

902

A11KR11KR26E102A

A11KR11KR26E102A

JST

JUMPER 11KR-6S-P - 11KR-6S-P 4"

992

A06ZR06ZR28H254A

A06ZR06ZR28H254A

JST

JUMPER 06ZR-8M-P - 06ZR-8M-P 10"

945

A04KR04DA28W305B

A04KR04DA28W305B

JST

JUMPER 04DA-8M - 04KR-8M-P 12"

338

A08SR08SR30K102A

A08SR08SR30K102A

JST

JUMPER 08SR-3S - 08SR-3S 4"

460

A06SR06SR30K102A

A06SR06SR30K102A

JST

JUMPER 06SR-3S - 06SR-3S 4"

2255

A05SUR05SUR32W305B

A05SUR05SUR32W305B

JST

JUMPER 05SUR-32S - 05SUR-32S 12"

1362

A04KR04DA28W152B

A04KR04DA28W152B

JST

JUMPER 04DA-8M - 04KR-8M-P 6"

366

A14SR14SR30K102A

A14SR14SR30K102A

JST

JUMPER 14SR-3S - 14SR-3S 4"

871

A02SUR02SUR32W152A

A02SUR02SUR32W152A

JST

JUMPER 02SUR-32S -02SUR-32S 6"

0

A09SR09SR30K254A

A09SR09SR30K254A

JST

JUMPER 09SR-3S - 09SR-3S 10"

986

A03SUR03SUR32W254B

A03SUR03SUR32W254B

JST

JUMPER 03SUR-32S - 03SUR-32S 10"

512

A04KR04KR26E305A

A04KR04KR26E305A

JST

JUMPER 04KR-6S-P - 04KR-6S-P 12"

386

A02SUR02SUR32W152B

A02SUR02SUR32W152B

JST

JUMPER 02SUR-32S - 02SUR-32S 6"

0

A09SR09SR30K152A

A09SR09SR30K152A

JST

JUMPER 09SR-3S - 09SR-3S 6"

901

A08ZR08ZR28H203B

A08ZR08ZR28H203B

JST

JUMPER 08ZR-8M-P - 08ZR-8M-P 8"

983

A20XSR20XSR36R102B

A20XSR20XSR36R102B

JST

JUMPER 20XSR-36S - 20XSR-36S 4"

935

A11ZR11ZR28H254B

A11ZR11ZR28H254B

JST

JUMPER 11ZR-8M-P - 11ZR-8M-P 10"

1000

A04ZR04ZR28H51B

A04ZR04ZR28H51B

JST

JUMPER 04ZR-8M-P - 04ZR-8M-P 2"

660

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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