Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A06KR06DA28W51B

A06KR06DA28W51B

JST

JUMPER 06DA-8M - 06KR-8M-P 2"

129

A06XSR06XSR36R254B

A06XSR06XSR36R254B

JST

JUMPER 06XSR-36S - 06XSR-36S 10"

971

A20XSR20XSR36R102A

A20XSR20XSR36R102A

JST

JUMPER 20XSR-36S - 20XSR-36S 4"

1441

A11ZR11ZR28H152B

A11ZR11ZR28H152B

JST

JUMPER 11ZR-8M-P - 11ZR-8M-P 6"

925

A07SR07SR30K254A

A07SR07SR30K254A

JST

JUMPER 07SR-3S - 07SR-3S 10"

959

A06XSR06XSR36R51B

A06XSR06XSR36R51B

JST

JUMPER 06XSR-36S - 06XSR-36S 2"

901

A09ZR09ZR28H102A

A09ZR09ZR28H102A

JST

JUMPER 09ZR-8M-P - 09ZR-8M-P 4"

991

A08XAF08XAF22K305A

A08XAF08XAF22K305A

JST

JUMPER 08XAF-2S - 08XAF-2S 12"

0

A06ZR06ZR28H305A

A06ZR06ZR28H305A

JST

JUMPER 06ZR-8M-P - 06ZR-8M-P 12"

628

A02XSR02XSR36R203B

A02XSR02XSR36R203B

JST

JUMPER 02XSR-36S - 02XSR-36S 8"

949

A03SR03SR30K152A

A03SR03SR30K152A

JST

JUMPER 03SR-3S - 03SR-3S 6"

0

A14SR14SR30K51A

A14SR14SR30K51A

JST

JUMPER 14SR-3S - 14SR-3S 2"

860

A13SR13SR30K254A

A13SR13SR30K254A

JST

JUMPER 13SR-3S - 13SR-3S 10"

915

A11ZR11ZR28H203B

A11ZR11ZR28H203B

JST

JUMPER 11ZR-8M-P - 11ZR-8M-P 8"

993

A02SUR02SUR32W51B

A02SUR02SUR32W51B

JST

JUMPER 02SUR-32S - 02SUR-32S 2"

1933

A02KR02DA28W305B

A02KR02DA28W305B

JST

JUMPER 02DA-8M - 02KR-8M-P 12"

462

A05ZR05ZR28H51A

A05ZR05ZR28H51A

JST

JUMPER 05ZR-8M-P - 05ZR-8M-P 2"

13

A04XAF04XAF22K305B

A04XAF04XAF22K305B

JST

JUMPER 04XAF-2S - 04XAF-2S 12"

1141

A04KR04KR26E102A

A04KR04KR26E102A

JST

JUMPER 04KR-6S-P - 04KR-6S-P 4"

1749

A10XSR10XSR36R295B

A10XSR10XSR36R295B

JST

JUMPER 10XSR-36S - 10XSR-36S 12"

941

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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