Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A06XSR06XSR36R203B

A06XSR06XSR36R203B

JST

JUMPER 06XSR-36S - 06XSR-36S 8"

905

A10XSR10XSR36R51B

A10XSR10XSR36R51B

JST

JUMPER 10XSR-36S - 10XSR-36S 2"

492

A08SUR08SUR32W305B

A08SUR08SUR32W305B

JST

JUMPER 08SUR-32S - 08SUR-32S 12"

341

A06SUR06SUR32W254A

A06SUR06SUR32W254A

JST

JUMPER 06SUR-32S - 06SUR-32S 10"

960

A15KR15KR26E102A

A15KR15KR26E102A

JST

JUMPER 15KR-6S-P - 15KR-6S-P 4"

989

A06KR06KR26E51A

A06KR06KR26E51A

JST

JUMPER 06KR-6S-P - 06KR-6S-P 2"

546

A02SUR02SUR32W102B

A02SUR02SUR32W102B

JST

JUMPER 02SUR-32S -02SUR-32S 4"

352

A11KR11KR26E203B

A11KR11KR26E203B

JST

JUMPER 11KR-6S-P - 11KR-6S-P 8"

975

A07ZR07ZR28H203B

A07ZR07ZR28H203B

JST

JUMPER 07ZR-8M-P - 07ZR-8M-P 8"

889

A08SR08SR30K203A

A08SR08SR30K203A

JST

JUMPER 08SR-3S - 08SR-3S 8"

1246

A02XSR02XSR36R51B

A02XSR02XSR36R51B

JST

JUMPER 02XSR-36S - 02XSR-36S 2"

755

A10SUR10SUR32W102A

A10SUR10SUR32W102A

JST

JUMPER 10SUR-32S - 10SUR-32S 4"

182

A03KR03KR26E254A

A03KR03KR26E254A

JST

JUMPER 03KR-6S-P - 03KR-6S-P 10"

859

A15KR15KR26E51A

A15KR15KR26E51A

JST

JUMPER 15KR-6S-P - 15KR-6S-P 2"

987

A02XAF02XAF22K203A

A02XAF02XAF22K203A

JST

JUMPER 02XAF-2S - 02XAF-2S 8"

935

A20XSR20XSR36R254B

A20XSR20XSR36R254B

JST

JUMPER 20XSR-36S - 20XSR-36S 10"

936

A08SR08SR30K203B

A08SR08SR30K203B

JST

JUMPER 08SR-3S - 08SR-3S 8"

2777

A06XSR06XSR36R152A

A06XSR06XSR36R152A

JST

JUMPER 06XSR-36S - 06XSR-36S 6"

956

A02XSR02XSR36R295B

A02XSR02XSR36R295B

JST

JUMPER 02XSR-36S - 02XSR-36S 12"

672

A04ZRE04ZRE26W102B

A04ZRE04ZRE26W102B

JST

JUMPER ZRE 4POS 26AWG 4-INCH

615

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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