Rectangular Cable Assemblies

Part Number	Description / PDF	Quantity
1451300601 Woodhead - Molex	NANO-FIT-TO-NANO-FIT OFF-THE-SHE	1010
0923150850 Woodhead - Molex	8CKT PICOFLEX 500MM LONG	0
0923152010 Woodhead - Molex	20CKT PICOFLEX 100MM LONG	1851
2162721021 Woodhead - Molex	SL POSITIVE LOCK P-P 2CKT 100MM	0
1451350200 Woodhead - Molex	MINI-FIT 2 CIRCUIT 75MM	59
0151320403 Woodhead - Molex	CABLE ASSY PICOLOCK 4 POS 300MM	357
0151371403 Woodhead - Molex	MINI-LOCK-TO-MINI-LOCK OFF-THE-S	28
0151341405 Woodhead - Molex	PICOBLADE 14 CIRCUIT 450MM	99
0923150832 Woodhead - Molex	8CCT PICOFLEX HARNESS 320MM LONG	0
2162731063 Woodhead - Molex	SL POSITIVE LOCK P-S 6CKT 300MM	0
2147512062 Woodhead - Molex	MICROFIT 3.0 SR R-S 6CKT 300 MM	325
0369200503 Woodhead - Molex	PICOEZMATE 5 CIRCUIT 300MM	312
2164011043 Woodhead - Molex	MEGAFIT SR R-S 4 CKT 600 MM CABL	0
2451350620 Woodhead - Molex	MINIFIT JR 6 CIRCUIT BLACK 2M	575
0451350401 Woodhead - Molex	MINIFIT 4 CIRCUIT 150MM CABLE AS	575
2151700603 Woodhead - Molex	CABLE ASSY. 6 CKT PICO-CLASP 600	0
2162881041 Woodhead - Molex	MX150 P-S DR 4CKT 150MM SN SEALE	0
0151340703 Woodhead - Molex	PICOBLADE 7 CIRCUIT 300MM	984
2147551061 Woodhead - Molex	MICRO-FIT3.0 R-R 6 CIRCUIT 150MM	95
2162721084 Woodhead - Molex	SL POSITIVE LOCK P-P 8CKT 600MM	0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
D-Subminiature	Metal-shielded, screw-locking design	Industrial computers, military equipment
IDC (Insulation Displacement)	Tool-less termination, flat cable compatibility	Telecom switches, HVAC systems
Board-to-Board	Low-profile, high-pin-count options	Servers, medical imaging devices
Ribbon Cable	Parallel signal routing, flexible dielectric	Computer peripherals, test equipment

3. Structure and Components

Typical construction includes:

Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
Shielding: Braided copper or conductive polymer layers
Strain relief: Molded thermoplastic overbraiding
Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

Parameter	Typical Range	Importance
Rated Voltage	50V - 600V	Ensures dielectric safety
Current Capacity	1A - 15A per contact	Determines power handling
Contact Resistance	5-20m	Impacts signal integrity
Insulation Resistance	100M - 10G	Prevents leakage currents
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500 - 5000 cycles	Durability indicator

5. Application Fields

Primary sectors include:

Computer & Peripherals: Server backplanes, GPU interconnects
Telecommunications: 5G base stations, optical network terminals
Industrial Automation: PLC interfaces, robotic controllers
Medical Equipment: MRI scanners, diagnostic devices
Transportation: EV battery management systems, avionics

6. Leading Manufacturers

Manufacturer	Key Products
Amphenol Corporation	D-Sub 90 PCB Mount Series
TE Connectivity	MATE-AX High-Speed Backplane Cables
Molex LLC	PicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.	QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

Electrical requirements (voltage/current profiles)
Mechanical constraints (space limitations, vibration exposure)
Environmental factors (temperature extremes, chemical exposure)
Signal integrity needs (impedance control, crosstalk reduction)
Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

Miniaturization: 0.4mm pitch connectors for mobile devices
High-speed capabilities: 25+ Gbps differential pair designs
Smart integration: Embedded sensors for condition monitoring
Sustainability focus: Halogen-free materials adoption
Automated manufacturing: AI-driven quality control systems