Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
0923150824

0923150824

Woodhead - Molex

8CCT PICOFLEX 240MM LONG

3198

0151370306

0151370306

Woodhead - Molex

MINI-LOCK-TO-MINI-LOCK OFF-THE-S

1165

2166231041

2166231041

Woodhead - Molex

SQUBA 3.6 P-S 4CKT 150MM SN

0

2153261062

2153261062

Woodhead - Molex

MINIFIT JR DR R-S 6 CIRCUIT 300M

0

2153272101

2153272101

Woodhead - Molex

MINIFIT JR DR P-P 10 CIRCUIT 150

0

2153201023

2153201023

Woodhead - Molex

MINIFIT JR SR R-R 2 CIRCUIT 600M

75

2153282043

2153282043

Woodhead - Molex

MINIFIT JR DR P-S 4 CIRCUIT 600M

0

2147562043

2147562043

Woodhead - Molex

MICRO-FIT3.0 R-S 4 CIRCUIT 600MM

1238

2451360605

2451360605

Woodhead - Molex

MEGAFIT 6CKT BLACK 500MM OVERMOL

92

2153231033

2153231033

Woodhead - Molex

MINIFIT JR SR M-S 3 CIRCUIT 600M

71

2451351005

2451351005

Woodhead - Molex

MINIFIT JR 10 CIRCUIT BLACK 500M

128

0151340806

0151340806

Woodhead - Molex

PICOBLADE 8 CIRCUIT 600MM

0

0151330606

0151330606

Woodhead - Molex

PICO-CLASP 6 CIRCUIT 600MM

382

2451360205

2451360205

Woodhead - Molex

MEGAFIT 2 CIRCUIT BLACK 500MM OV

51

0451110300

0451110300

Woodhead - Molex

MICROLOCK PLUS CABLE BLACK 3 CKT

936

2147552042

2147552042

Woodhead - Molex

MICRO-FIT3.0 R-R 4 CIRCUIT 300MM

0

0151330700

0151330700

Woodhead - Molex

PICO-CLASP 7 CIRCUIT 50MM

0

0451420301

0451420301

Woodhead - Molex

FCT 3 CKT CPA MULTICAT 300MM AWG

10

2162901012

2162901012

Woodhead - Molex

STANDARD .093 1 CIRCUIT R TO R 3

0

2147511061

2147511061

Woodhead - Molex

MICROFIT 3.0 SR R-S 6CKT 150 MM

425

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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