Rectangular Cable Assemblies

Image	Part Number	Description / PDF	Quantity	Rfq
	STM051SC2DM012N TE Connectivity Aerospace Defense and Marine	STM051SC2DM012N = WDUALOBE	0
	SSM037PC2DX012 TE Connectivity Aerospace Defense and Marine	SSM037PC2DX012 = WDUALOBE	0
	USS037PC1DXC20 TE Connectivity Aerospace Defense and Marine	USS037PC1DXC20 = STRIP CON	0
	USS015SC3DX004T TE Connectivity Aerospace Defense and Marine	STRIP CON	0
	USS015PC2DC018V TE Connectivity Aerospace Defense and Marine	STRIP CON	0
	SSL015SC2DC036N TE Connectivity Aerospace Defense and Marine	WDUALOBE CONNECTOR	0
	SSM009PC2DX010N TE Connectivity Aerospace Defense and Marine	SSM009PC2DX010N = WDUALOBE	0
	STL051PC2DC024N TE Connectivity Aerospace Defense and Marine	STL051PC2DC024N = WDUALOBE	0
	STM065PC0DC006N TE Connectivity Aerospace Defense and Marine	STM065PC0DC006N = WDUALOBE	0
	SSM015PC2DC048N TE Connectivity Aerospace Defense and Marine	SSM015PC2DC048N = WDUALOBE	0
	STL051SC2DC048 TE Connectivity Aerospace Defense and Marine	CONN RCPT 51POS 30AWG 48IN	0
	USS004PC3DC018 TE Connectivity Aerospace Defense and Marine	USS004PC3DC018 = STRIP CON	0
	STM065SC2DM024Q TE Connectivity Aerospace Defense and Marine	STM065SC2DM024Q = WDUALOBE	0
	2-1589677-0 TE Connectivity Aerospace Defense and Marine	N11446 = HEADER	0
	SSM037PC2DC018N TE Connectivity Aerospace Defense and Marine	CONN PLUG 37POS 30AWG 18IN	0
	CX080PC2RG012Q TE Connectivity Aerospace Defense and Marine	CX080PC2RG012Q = COAX	0
	STM051SC2DC036N TE Connectivity Aerospace Defense and Marine	STM051SC2DC036N = WDUALOBE	0
	STM025SC2DM036N TE Connectivity Aerospace Defense and Marine	WDUALOBE CONNECTOR	0
	SSM051PC2DMC30N TE Connectivity Aerospace Defense and Marine	SSM051PC2DMC30N = WDUALOBE	0
	SSM005SC4DX012N TE Connectivity Aerospace Defense and Marine	CONN RCPT 5POS 34AWG 12IN	0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
D-Subminiature	Metal-shielded, screw-locking design	Industrial computers, military equipment
IDC (Insulation Displacement)	Tool-less termination, flat cable compatibility	Telecom switches, HVAC systems
Board-to-Board	Low-profile, high-pin-count options	Servers, medical imaging devices
Ribbon Cable	Parallel signal routing, flexible dielectric	Computer peripherals, test equipment

3. Structure and Components

Typical construction includes:

Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
Shielding: Braided copper or conductive polymer layers
Strain relief: Molded thermoplastic overbraiding
Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

Parameter	Typical Range	Importance
Rated Voltage	50V - 600V	Ensures dielectric safety
Current Capacity	1A - 15A per contact	Determines power handling
Contact Resistance	5-20m	Impacts signal integrity
Insulation Resistance	100M - 10G	Prevents leakage currents
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500 - 5000 cycles	Durability indicator

5. Application Fields

Primary sectors include:

Computer & Peripherals: Server backplanes, GPU interconnects
Telecommunications: 5G base stations, optical network terminals
Industrial Automation: PLC interfaces, robotic controllers
Medical Equipment: MRI scanners, diagnostic devices
Transportation: EV battery management systems, avionics

6. Leading Manufacturers

Manufacturer	Key Products
Amphenol Corporation	D-Sub 90 PCB Mount Series
TE Connectivity	MATE-AX High-Speed Backplane Cables
Molex LLC	PicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.	QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

Electrical requirements (voltage/current profiles)
Mechanical constraints (space limitations, vibration exposure)
Environmental factors (temperature extremes, chemical exposure)
Signal integrity needs (impedance control, crosstalk reduction)
Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

Miniaturization: 0.4mm pitch connectors for mobile devices
High-speed capabilities: 25+ Gbps differential pair designs
Smart integration: Embedded sensors for condition monitoring
Sustainability focus: Halogen-free materials adoption
Automated manufacturing: AI-driven quality control systems