Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
C3DDG-5006M

C3DDG-5006M

CW Industries

IDC CABLE - CKR50G/AE50M/CKR50G

0

C2PXS-1618G

C2PXS-1618G

CW Industries

DIP CABLE - CDP16S/AE16G/X

0

C3BBG-1018G

C3BBG-1018G

CW Industries

IDC CABLE - CSR10G/AE10G/CSR10G

0

C8RRG-1436G

C8RRG-1436G

CW Industries

DIP CABLE - CDR14G/AE14G/CDR14G

0

C3AAS-3406M

C3AAS-3406M

CW Industries

IDC CABLE - CSC34S/AE34M/CSC34S

0

C8RRS-1606M

C8RRS-1606M

CW Industries

DIP CABLE - CDR16S/AE16M/CDR16S

0

C3BBG-6006M

C3BBG-6006M

CW Industries

IDC CABLE - CSR60G/AE60M/CSR60G

0

C3CCG-1436M

C3CCG-1436M

CW Industries

IDC CABLE - CKC14G/AE14M/CKC14G

0

C2RXS-2436G

C2RXS-2436G

CW Industries

DIP CABLE - CDR24S/AE24G/X

0

C6PPG-1406G

C6PPG-1406G

CW Industries

DIP CABLE - CDP14G/AE14G/CDP14G

0

C1BXG-2036G

C1BXG-2036G

CW Industries

IDC CABLE - CSR20G/AE20G/X

0

C4PXS-1406M

C4PXS-1406M

CW Industries

DIP CABLE - CDP14S/AE14M/X

0

C3BBG-1006M

C3BBG-1006M

CW Industries

IDC CABLE - CSR10G/AE10M/CSR10G

0

C3CES-1006G

C3CES-1006G

CW Industries

IDC CABLE - CKC10S/AE10G/CCE10S

0

C1AXG-2636M

C1AXG-2636M

CW Industries

IDC CABLE - CSC26G/AE26M/X

0

C2RXS-1406G

C2RXS-1406G

CW Industries

DIP CABLE - CDR14S/AE14G/X

0

C8PPS-1606G

C8PPS-1606G

CW Industries

DIP CABLE - CDP16S/AE16G/CDP16S

0

C0RRS-1606G

C0RRS-1606G

CW Industries

DIP CABLE - CDR16S/AE16G/CDR16S

0

C3DEG-5006G

C3DEG-5006G

CW Industries

IDC CABLE - CKR50G/AE50G/CCE50G

0

C3DEG-2036M

C3DEG-2036M

CW Industries

IDC CABLE - CKR20G/AE20M/CCE20G

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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