Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3DDK-2640K

M3DDK-2640K

3M

IDC CABLE - MKR26K/MC26F/MKR26K

0

4763

4763

Pololu Corporation

6-PIN FEMALE JST SH-STYLE CABLE

968

HQCD-060-06.00-TED-SED-1-B

HQCD-060-06.00-TED-SED-1-B

Samtec, Inc.

CBL ASSM M-F 120POS 6" HDR

0

FFSD-13-D-10.00-01-N

FFSD-13-D-10.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSY

64

2153271083

2153271083

Woodhead - Molex

MINIFIT JR DR P-P 8 CIRCUIT 600M

374

A3AAH-3418M

A3AAH-3418M

TE Connectivity AMP Connectors

IDC CABLE - ASC34H/AE34M/ASC34H

0

M3CEK-2036R

M3CEK-2036R

3M

IDC CABLE - MKC20K/MC20M/MCE20K

0

M3CWK-1018J

M3CWK-1018J

3M

IDC CABLE - MKC10K/MC10G/MPL10K

0

0923151232

0923151232

Woodhead - Molex

12CKT PICOFLEX 320MM LONG

2300

0923151432

0923151432

Woodhead - Molex

14CKT PICOFLEX 320MM LONG

1970

T1SDT-09-28-GF-02.0-T3

T1SDT-09-28-GF-02.0-T3

Samtec, Inc.

CBL ASSY 1MM 18POS M TO F

0

M3CGK-2018J

M3CGK-2018J

3M

IDC CABLE - MKC20K/MC20G/MCS20K

0

H3KKH-3418M

H3KKH-3418M

ASSMANN WSW Components

IDC CBL - HHPK34H/AE34M/HHPK34H

0

M3DGK-2606J

M3DGK-2606J

3M

IDC CABLE - MKR26K/MC26G/MCS26K

0

0923150808

0923150808

Woodhead - Molex

8CCT PICOFLEX 80MM LONG

500

FFSD-15-D-18.50-01-N

FFSD-15-D-18.50-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3AAA-2636J

M3AAA-2636J

3M

IDC CABLE - MSC26A/MC26G/MSC26A

0

M3RRK-5018J

M3RRK-5018J

3M

IDC CABLE - MPR50K/MC50G/MPR50K

0

2153211063

2153211063

Woodhead - Molex

MINIFIT JR SR R-S 6 CIRCUIT 600M

500

A02XAF02XAF22K152A

A02XAF02XAF22K152A

JST

JUMPER 02XAF-2S - 02XAF-2S 6"

236

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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