Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3FFK-3460K

M3FFK-3460K

3M

IDC CABLE - MCF34K/MC34F/MCF34K

0

FFSD-25-D-11.85-01-N

FFSD-25-D-11.85-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3BYK-1018R

M3BYK-1018R

3M

IDC CABLE - MSR10K/MC10M/MPD10K

0

M3AMK-4018J

M3AMK-4018J

3M

IDC CABLE - MSC40K/MC40G/MCG40K

0

TCMD-10-D-02.00-01

TCMD-10-D-02.00-01

Samtec, Inc.

CABLE ASSEM 2MM 20POS M-M 2"

0

H3KKH-1418G

H3KKH-1418G

ASSMANN WSW Components

IDC CBL - HHPK14H/AE14G/HHPK14H

0

M3DDK-2436J

M3DDK-2436J

3M

IDC CABLE - MKR24K/MC24G/MKR24K

0

H8MMS-3018M

H8MMS-3018M

ASSMANN WSW Components

DIP CBL - HHDM30S/AE30M/HHDM30S

0

M3CCA-1018R

M3CCA-1018R

3M

IDC CABLE - MKC10A/MC10M/MKC10A

92

M3BGK-1036R

M3BGK-1036R

3M

IDC CABLE - MSR10K/MC10M/MCS10K

0

FFSD-08-D-07.81-01-N

FFSD-08-D-07.81-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M55-8005042-0150A

M55-8005042-0150A

Harwin

CBL ASSEM 1.27MM 50POS F-F 150MM

51

C3BBG-3418G

C3BBG-3418G

CW Industries

IDC CABLE - CSR34G/AE34G/CSR34G

0

2164011062

2164011062

Woodhead - Molex

MEGAFIT SR R-S 6 CKT 300 MM CABL

0

A3AAH-1036M

A3AAH-1036M

TE Connectivity AMP Connectors

IDC CABLE - ASC10H/AE10M/ASC10H

0

C3DDS-1436M

C3DDS-1436M

CW Industries

IDC CABLE - CKR14S/AE14M/CKR14S

0

FFSD-20-D-99.00-01-N

FFSD-20-D-99.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

2174651042

2174651042

Woodhead - Molex

ULTRA-FIT SR R-R 4CKT 300MM DISC

0

0451330201

0451330201

Woodhead - Molex

ULTRAFIT 2 CIRCUIT BLACK 150MM

682

M1DXA-1036J

M1DXA-1036J

3M

IDC CABLE - MKR10A/MC10G/X

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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