Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
FFSD-05-D-06.00-01-N-R

FFSD-05-D-06.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

DF36A50PP-UL42S110

DF36A50PP-UL42S110

SINBON

DF36A 50P DOUBLE-ENDED, 110MM

5

C3AES-5018G

C3AES-5018G

CW Industries

IDC CABLE - CSC50S/AE50G/CCE50S

0

FFSD-17-D-16.00-01-N-R

FFSD-17-D-16.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3BFK-6018J

M3BFK-6018J

3M

IDC CABLE - MSR60K/MC60G/MCF60K

0

FFSD-05-D-06.30-01-N

FFSD-05-D-06.30-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-10-D-61.00-01-N

FFSD-10-D-61.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-15-D-07.25-01-N

FFSD-15-D-07.25-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M1RXK-3440K

M1RXK-3440K

3M

IDC CABLE - MPR34K/MC34F/X

0

2147551043

2147551043

Woodhead - Molex

MICRO-FIT3.0 R-R 4 CIRCUIT 600MM

1192

H3CCS-2406G

H3CCS-2406G

ASSMANN WSW Components

IDC CBL - HHKC24S/AE24G/HHKC24S

0

C3DDG-5018G

C3DDG-5018G

CW Industries

IDC CABLE - CKR50G/AE50G/CKR50G

0

M3EEK-1036R

M3EEK-1036R

3M

IDC CABLE - MCE10K/MC10M/MCE10K

0

M3AGK-4040K

M3AGK-4040K

3M

IDC CABLE - MSC40K/MC40F/MCS40K

0

M3BMK-2620K

M3BMK-2620K

3M

IDC CABLE - MSR26K/MC26F/MCG26K

0

FFSD-14-D-24.00-01-N-D12

FFSD-14-D-24.00-01-N-D12

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-10-D-03.75-01-N-R

FFSD-10-D-03.75-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-20-D-34.00-01-N

FFSD-20-D-34.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3DFK-2660K

M3DFK-2660K

3M

IDC CABLE - MKR26K/MC26F/MCF26K

0

2147572082

2147572082

Woodhead - Molex

MICRO-FIT3.0 P-P 8 CIRCUIT 300MM

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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