Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A3BRB-1636G

A3BRB-1636G

TE Connectivity AMP Connectors

IDC CABLE - ASR16B/AE16G/APR16B

0

FFSD-05-D-02.76-01-N

FFSD-05-D-02.76-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A8MMS-1636M

A8MMS-1636M

TE Connectivity AMP Connectors

ADM16S/AE16M/ADM16S

0

G125-MC12005L4-0450L

G125-MC12005L4-0450L

Harwin

1.25MM M/L 20POS 26AWG 450MM

22

C3CES-2618G

C3CES-2618G

CW Industries

IDC CABLE - CKC26S/AE26G/CCE26S

0

FFSD-25-D-15.75-01-N

FFSD-25-D-15.75-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

33152430100010

33152430100010

HARTING

CABLE ASSY 32POS RCPT-RCPT 100MM

67

A3BRB-1406M

A3BRB-1406M

TE Connectivity AMP Connectors

IDC CABLE - ASR14B/AE14M/APR14B

0

2153201053

2153201053

Woodhead - Molex

MINIFIT JR SR R-R 5 CIRCUIT 600M

50

M3UEK-1036J

M3UEK-1036J

3M

IDC CABLE - MKS10K/MC10G/MCE10K

0

C3EEG-2618G

C3EEG-2618G

CW Industries

IDC CABLE - CCE26G/AE26G/CCE26G

0

C0RRS-1636M

C0RRS-1636M

CW Industries

DIP CABLE - CDR16S/AE16M/CDR16S

0

2162931043

2162931043

Woodhead - Molex

STANDARD .093 4 CIRCUIT P TO S 6

0

1451300303

1451300303

Woodhead - Molex

NANO-FIT-TO-NANO-FIT OFF-THE-SHE

915

H3KKH-6006G

H3KKH-6006G

ASSMANN WSW Components

IDC CBL - HHPK60H/AE60G/HHPK60H

0

C3DES-2036G

C3DES-2036G

CW Industries

IDC CABLE - CKR20S/AE20G/CCE20S

0

0923150616

0923150616

Woodhead - Molex

6CKT PICOFLEX 160MM LONG

0

C3DDS-5018G

C3DDS-5018G

CW Industries

IDC CABLE - CKR50S/AE50G/CKR50S

0

FFMD-20-D-02.00-01

FFMD-20-D-02.00-01

Samtec, Inc.

CABLE ASSEM .05" 40POS M-M 2"

0

FFSD-17-D-40.00-01-N-R

FFSD-17-D-40.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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