Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A06DS06DS28W305B

A06DS06DS28W305B

JST

JUMPER 06DS-8E - 06DS-8E 12"

101

FFSD-10-D-17.00-01-N-R

FFSD-10-D-17.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

ERCD-010-40.00-TEU-TED-1-D

ERCD-010-40.00-TEU-TED-1-D

Samtec, Inc.

CBL ASSEM M-M 20POS 40" HDR

10

M1RXK-4040K

M1RXK-4040K

3M

IDC CABLE - MPR40K/MC40F/X

0

2153272083

2153272083

Woodhead - Molex

MINIFIT JR DR P-P 8 CIRCUIT 600M

0

A04SUR04SUR32W152B

A04SUR04SUR32W152B

JST

JUMPER 04SUR-32S - 04SUR-32S 6"

320

FFSD-25-D-27.00-01-N

FFSD-25-D-27.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H3DDS-1018M

H3DDS-1018M

ASSMANN WSW Components

IDC CBL - HHKR10S/AE10M/HHKR10S

0

M3FFK-1660K

M3FFK-1660K

3M

IDC CABLE - MCF16K/MC16F/MCF16K

0

FFSD-05-D-12.00-01-N-D03

FFSD-05-D-12.00-01-N-D03

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H6PPS-2436M

H6PPS-2436M

ASSMANN WSW Components

DIP CABLE - HDP24S/AE24M/HDP24S

0

M1CXA-3436J

M1CXA-3436J

3M

IDC CABLE - MKC34A/MC34G/X

9

0151321006

0151321006

Woodhead - Molex

CABLE ASSY PICOLOCK 10 POS 600MM

1759

A3CCH-6436M

A3CCH-6436M

TE Connectivity AMP Connectors

IDC CABLE - AKC64H/AE64M/AKC64H

0

C3DDG-2606G

C3DDG-2606G

CW Industries

IDC CABLE - CKR26G/AE26G/CKR26G

0

A2MXS-2418G

A2MXS-2418G

TE Connectivity AMP Connectors

ADM24S/AE24G/X

0

2147562042

2147562042

Woodhead - Molex

MICRO-FIT3.0 R-S 4 CIRCUIT 300MM

25

M3BBK-1006J

M3BBK-1006J

3M

IDC CABLE - MSR10K/MC10G/MSR10K

0

M3UFK-2606J

M3UFK-2606J

3M

IDC CABLE - MKS26K/MC26G/MCF26K

0

C3CES-2636G

C3CES-2636G

CW Industries

IDC CABLE - CKC26S/AE26G/CCE26S

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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