Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
H3BBH-2036G

H3BBH-2036G

ASSMANN WSW Components

IDC CBL - HHSR20H/AE20G/HHSR20H

0

C4RXG-2406M

C4RXG-2406M

CW Industries

DIP CABLE - CDR24G/AE24M/X

0

C3BPS-1036M

C3BPS-1036M

CW Industries

IDC CABLE - CSR10S/AE10M/CPC10S

0

M3BBA-3036R

M3BBA-3036R

3M

IDC CABLE - MSR30A/MC34M/MSR30A

0

M1DXK-5036J

M1DXK-5036J

3M

IDC CABLE - MKR50K/MC50G/X

0

FFSD-17-D-02.75-01-N

FFSD-17-D-02.75-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H0PPS-4036G

H0PPS-4036G

ASSMANN WSW Components

DIP CABLE - HDP40S/AE40G/HDP40S

0

M3TTK-5020K

M3TTK-5020K

3M

IDC CABLE - MSD50K/MC50F/MSD50K

0

C2RXS-1436M

C2RXS-1436M

CW Industries

DIP CABLE - CDR14S/AE14M/X

0

M3TFK-6036R

M3TFK-6036R

3M

IDC CABLE - MSD60K/MC60M/MCF60K

0

M3CEK-1036R

M3CEK-1036R

3M

IDC CABLE - MKC10K/MC10M/MCE10K

0

M55-8006842-0150A

M55-8006842-0150A

Harwin

CBL ASSEM 1.27MM 68POS F-F 150MM

30

H3DDH-6436G

H3DDH-6436G

ASSMANN WSW Components

IDC CBL - HHKR64H/AE64G/HHKR64H

0

M3EEK-4060K

M3EEK-4060K

3M

IDC CABLE - MCE40K/MC40F/MCE40K

0

A3AKB-1636M

A3AKB-1636M

TE Connectivity AMP Connectors

IDC CABLE - ASC16B/AE16M/APK16B

0

FFSD-05-D-19.68-01-N

FFSD-05-D-19.68-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M1EXK-4036R

M1EXK-4036R

3M

IDC CABLE - MCE40K/MC40M/X

0

M3BBA-2636J

M3BBA-2636J

3M

IDC CABLE - MSR26A/MC26G/MSR26A

0

FFSD-16-D-06.00-01-N

FFSD-16-D-06.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

0451330801

0451330801

Woodhead - Molex

ULTRAFIT 8 CIRCUIT BLACK 150MM

113

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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