| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
VEAM |
MICRO 25C P 72" RBW JACKS NI |
0 |
|
|
VEAM |
CABLE ASY D TO WIRE 31P 914.4MM |
0 |
|
|
VEAM |
MICRO 21C P 24" YEL JACKP NI |
0 |
|
|
VEAM |
CABLE ASY D-WIRE 100P 914.4MM |
0 |
|
|
VEAM |
CANMDM-25SH013P |
0 |
|
|
VEAM |
MICRO |
0 |
|
|
VEAM |
MICRO |
0 |
|
|
VEAM |
MICRO |
0 |
|
|
VEAM |
MICRO 21C P 120" YEL JACKP |
0 |
|
|
VEAM |
MICRO 31C S 12" WHT JACKP NI |
0 |
|
|
VEAM |
MICRO 9C P 36" WHT JACKS NI |
0 |
|
|
VEAM |
MICRO 21C S 48" WHT JACKP NI |
0 |
|
|
VEAM |
MICRO |
0 |
|
|
VEAM |
MICRO 9C S 20" WHT JACKP |
0 |
|
|
VEAM |
MICRO 31C S 6" YEL JACKP |
0 |
|
|
VEAM |
CABLE ASSY D TO WIRE 25P 254MM |
0 |
|
|
VEAM |
MICRO 9 F 48" JACKP |
0 |
|
|
VEAM |
MICRO 31 F 6" RBW M5 |
0 |
|
|
VEAM |
MICRO |
0 |
|
|
VEAM |
CABLE ASY D TO WIRE 51P 12.7MM |
0 |
|
D-Sub cables (D-Subminiature cables) are a family of multi-pin connectors characterized by their D-shaped metal shell and parallel pin arrangements. They were first introduced in 1952 by ITT Corporation and became a standard interface for serial and parallel communication in early computing and industrial systems. Despite the rise of modern interfaces like USB and HDMI, D-Sub cables remain critical in legacy systems, industrial automation, and specialized equipment due to their reliability and robust mechanical design.
| Type | Pin Count | Key Features | Applications |
|---|---|---|---|
| DE-9 | 9 | Compact size, low-cost signal transmission | RS-232 serial ports, gaming controllers |
| DB-15 | 15 | High-density pin layout | VGA video interfaces, Macintosh serial ports |
| DB-25 | 25 | Supports parallel data transfer | Printer ports, industrial sensors |
| DC-37 | 37 | High-pin-count for complex systems | Telecommunications, military equipment |
D-Sub cables consist of three primary elements: 1. D-Shaped Metal Shell: Provides EMI shielding and mechanical durability. 2. Pin Contacts: Typically made of phosphor bronze or beryllium copper with gold/silver plating for conductivity. 3. Dielectric Insulator: Prevents short circuits between pins, often using thermoplastic materials. Cable variants include standard 1:1 wiring and high-density designs with multiple contact rows.
| Parameter | Typical Value | Significance |
|---|---|---|
| Impedance | 50 -100 | Ensures signal integrity at high frequencies |
| Current Rating | 1A-5A per pin | Determines power delivery capability |
| Operating Temperature | -40 C to +85 C | Defines environmental tolerance |
| Shielding Effectiveness | 60dB-100dB | Reduces electromagnetic interference |
| Termination Type | Solder, crimp, or IDC | Influences durability and assembly method |
| Manufacturer | Key Product Series | Special Features |
|---|---|---|
| TE Connectivity | DELPHI D-Sub Cables | High-vibration resistance for industrial use |
| Amphenol | Dura-Con HD D-Sub | High-density 4-row configuration |
| Molex | PicoBlade D-Sub | Miniaturized design for compact devices |
| Samtec | QTRADE D-Sub | Quick-mate alignment system |
Key considerations include: 1. Match pin count and gender to host interface requirements. 2. Evaluate environmental factors (temperature, vibration). 3. Choose appropriate shielding for EMI-sensitive environments. 4. Consider termination method based on maintenance needs. 5. Verify compliance with industry standards (EIA/TIA-232, MIL-STD-188). Example: Selecting DB-9 cables with ferrite cores for industrial motor control cabinets to reduce noise interference.
While D-Sub cables face declining use in consumer electronics, they remain entrenched in industrial applications. Emerging trends include: 1. Hybrid D-Sub connectors integrating fiber optics alongside traditional pins. 2. Nanocoatings for corrosion resistance in harsh environments. 3. Increased adoption of high-density DA-15 interfaces in robotics. 4. RoHS-compliant materials replacing traditional tin-lead plating. The global D-Sub market is projected to maintain a 1.2% CAGR through 2030, primarily driven by industrial IoT deployments.