| Manufacturer Part | BCM985810HBMI |
|---|---|
| Manufacturer | Broadcom |
| Description | DEVELOPMENT KIT FOR BCM85810 HIG |
| Category | Development Boards, Kits, Programmers | MCU, FPGA, ADC Evaluation Kits | Ample Chip |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Availability | 0 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 09 - Dec 13 2025 |
In Stock Min.: 1 Mult.: 1
Not satisfied with the price? Want a lower wholesale price? Please send RFQ, and we will respond immediately
| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | - |
| Function: | - |
| Embedded: | - |
| Utilized IC / Part: | BCM85810 |
| Primary Attributes: | - |
| Supplied Contents: | Board(s) |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
CONN FFC BOTTOM 6POS 1.00MM R/A
CLIP SLEEVE & WM - LEGEND: 2
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FXPC OM1 ST ST 20M
IDENTITY COMPARATOR, FCT SERIES
IC TELECOM INTERFACE 16SOIC
DEVELOPMENT KIT FOR BCM85810 HIG
