| Manufacturer Part | 520-AG12D-LF |
|---|---|
| Manufacturer | TE Connectivity AMP Connectors |
| Description | CONN IC DIP SOCKET 20POS TIN |
| Category | Connectors & Interconnects Supplier | Ample Chip Electronics Component |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Datasheet | 520-AG12D-LF PDF |
| Availability | 0 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 08 - Dec 12 2025 |
In Stock Min.: 1 Mult.: 1
Not satisfied with the price? Want a lower wholesale price? Please send RFQ, and we will respond immediately
| Type | Description |
|---|---|
| Series: | 500 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 20 (2 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 105°C |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
FUSE CERAMIC 500MA 250VAC 5X20MM
XTAL OSC XO 26.0000MHZ CMOS SMD
SOT-223-5 TO DIP-6 SMT ADAPTER
IC CLK BUFFER 1:8 1.5GHZ 32MLF
5MM TAGS;POCKET MAXICARD;
CONN IC DIP SOCKET 20POS TIN
RSP30-08033O6TT-SK9V9HSE2AXX.X.X
