| Manufacturer Part | GP3004SF-0.023-01-0918 |
|---|---|
| Manufacturer | Henkel / Bergquist |
| Description | BERGQUIST GAP PAD TGP 3004SF |
| Category | Fans & Thermal Management Supplier | Ample Chip |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Availability | 0 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 08 - Dec 12 2025 |
In Stock Min.: 1 Mult.: 1
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| Type | Description |
|---|---|
| Series: | Gap Pad® 3004SF |
| Package: | Bulk |
| Part Status: | Active |
| Usage: | Thermally Conductive |
| Type: | Gap Filler Pad, Sheet |
| Shape: | Rectangular |
| Outline: | 457.20mm x 228.60mm |
| Thickness: | 0.0230" (0.584mm) |
| Material: | Non-Silicone |
| Adhesive: | Tacky - Both Sides |
| Backing, Carrier: | Fiberglass |
| Color: | Gray |
| Thermal Resistivity: | - |
| Thermal Conductivity: | 3.0W/m-K |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
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