| Manufacturer Part | 40-6554-10 |
|---|---|
| Manufacturer | Aries Electronics, Inc. |
| Description | CONN IC DIP SOCKET ZIF 40POS TIN |
| Category | Connectors & Interconnects Supplier | Ample Chip Electronics Component |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Datasheet | 40-6554-10 PDF |
| Availability | 207 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 08 - Dec 12 2025 |
In Stock Min.: 1 Mult.: 1
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| Type | Description |
|---|---|
| Series: | 55 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 40 (2 x 20) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
CONN IC DIP SOCKET ZIF 40POS TIN
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CONN BRD STACK 2.00 40POS
IE MINIFIBERLINX-II/LASTGASP MOD
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FIXED IND 56UH 190MA 5.5 OHM SMD
GTSL WITH THIN BLADE GUARD
