| Manufacturer Part | TSX713 |
|---|---|
| Manufacturer | EDSYN Inc. |
| Description | REFLOW VACUUM TIP, HOLE DIA: 1.3 |
| Category | Soldering, Desoldering, Rework Products Supplier | Ample Chip Electronics Component |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Availability | 5 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 08 - Dec 12 2025 |
In Stock Min.: 1 Mult.: 1
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| Type | Description |
|---|---|
| Series: | SOLDAVAC® |
| Package: | Bag |
| Part Status: | Active |
| Tip Type: | Rework |
| Tip Shape: | Nozzle |
| Height: | - |
| Width: | - |
| Length: | 0.551" (14.00mm) |
| Diameter: | 0.051" (1.30mm) |
| Tip Chip Size: | - |
| Temperature Range: | - |
| For Use With/Related Products: | - |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
